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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2023/07/19 PCN(Product Change Notice) The assembly and testing base: Renesas Semiconductor (Beijing) Co., Ltd (RSB)
Changes: Die-bonding material will be changed.
The new material are proven in assembly at RSB.

Effective Date: 10/16/2023
2023/10/01 PCN(Product Change Notice) Die-bonding materials will be changed for assembly location RSB (Renesas Semiconductor (Beijing) Co., Ltd).
The new materials are already proven and used for other products in RSB assembly.
2025/09/01 PCN(Product Change Notice) Notice of Change of Lead Frame for RA6M2/RA6M3/S3A3/S5D5/S5D9 Series LFQFP Package Products
2025/09/01 PCN(Product Change Notice) NOTICE OF CHANGE OF LEAD FRAME FOR RA6M2/RA6M3/S3A3/S5D5/S5D9 SERIES LFQFP PACKAGE PRODUCTS
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PCN/PDN/NRND Information
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Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

Product & Sales Information of products subject to notification

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Products: 67 out of cases/Show 1 to 25






   123  Last  NEXT
Products: 67 out of cases/Show 1 to 25