| 2021/01/08 |
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PCN(Product Change Notice)
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PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2021/03/11 |
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PCN(Product Change Notice)
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AMKOR ATP (Philippines) enhanced Die Attach (new material) - All listed product in UFBGA package |
| 2021/06/15 |
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PCN(Product Change Notice)
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Old> marking composition with no SS marking New> marking composition with additional SS marking
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| 2022/03/31 |
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PCN(Product Change Notice)
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Wire Bond Method/Material Change Description of change Old: ASE Kaohsiung back-end: - Gold wire bonding assembly line New: ASE Kaohsiung back-end :- Gold wire bonding assembly line - New Copper Palladium added assembly line Intended start of delivery 2022-03-31 |
| 2022/05/08 |
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PCN(Product Change Notice)
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NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |
| 2022/11/01 |
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PCN(Product Change Notice)
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Enhanced traceability harmonization for listed assembly sites & for all listed products Timing / schedule Intended start of delivery : 2022-11-01 |
| 2023/08/28 |
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PCN(Product Change Notice)
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ASE Kaohsiung (Taiwan) - qualification of a second source substrate supplier (SCC - Shennan Circuit Company) for BGA package, size from BGA5x5 to BGA18x18, for listed products
Old First source Supplier, either ASEMTL-SH or TCI or Kinsus or Nanya is used over the different impacted products. New First source remains either ASEMTL-SH or TCI or Kinsus or Nanya depending on the product. Second source supplier SCC for all impacted products.
Timing / schedule Intended start of delivery 2023-09-06 |
| 2024/10/09 |
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PCN(Product Change Notice)
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Description of change Old : Current Wire bonding material: - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) gold and Copper Palladium wire. New : Current Wire bonding material: - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) gold and Copper Palladium wire. New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire
Timing / schedule Intended start of delivery 2024-12-16 |
| 2025/02/28 |
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PCN(Product Change Notice)
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ST Crolles (France) additional source for STM32G41x/G47x/G48x, STM32L43x/L44x/L4Zx and STM32L47x/L48x products in M10/90nm technology. |