Chip One Stop - Shopping Site for Electronic Components and Semiconductors
Menu
Kingdom of Nepal
Change
English
SELECT YOUR LANGUAGE
USD
SELECT YOUR CURRENCY FOR DISPLAY
About Preferential Rank / Discount

Current price of Item(s) have been applied below.
 


・Preferential Rank and Discount rate will be applied according to your usage of our web service.
・Discount is only applicable to orders from chip1stop web site.
・Discounts may not be applicable to all products and may be subject to MOQ.
・Please contact your representative for details of Preferential Rank.
・No other coupons may be used in conjunction with this discount.

PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2021/01/08 PCN(Product Change Notice) PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2021/03/11 PCN(Product Change Notice) AMKOR ATP (Philippines) enhanced Die Attach (new material) - All listed product in UFBGA package
2021/06/15 PCN(Product Change Notice) Old> marking composition with no SS marking
New> marking composition with additional SS marking
2022/03/31 PCN(Product Change Notice) Wire Bond Method/Material Change
Description of change
Old: ASE Kaohsiung back-end: - Gold wire bonding assembly line
New: ASE Kaohsiung back-end :- Gold wire bonding assembly line
- New Copper Palladium added assembly line
Intended start of delivery 2022-03-31
2022/05/08 PCN(Product Change Notice) NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08
2022/11/01 PCN(Product Change Notice) Enhanced traceability harmonization for listed assembly sites & for all listed products
Timing / schedule Intended start of delivery : 2022-11-01
2023/08/28 PCN(Product Change Notice) ASE Kaohsiung (Taiwan)
- qualification of a second source substrate supplier (SCC - Shennan Circuit Company)
for BGA package, size from BGA5x5 to BGA18x18, for listed products

Old
First source Supplier, either ASEMTL-SH or TCI or Kinsus or Nanya is used over the different
impacted products.
New
First source remains either ASEMTL-SH or TCI or Kinsus or Nanya depending on the product.
Second source supplier SCC for all impacted products.

Timing / schedule Intended start of delivery 2023-09-06
2024/10/09 PCN(Product Change Notice) Description of change
Old : Current Wire bonding material:
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) gold and Copper Palladium wire.
New : Current Wire bonding material:
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) gold and Copper Palladium wire.
New Wire bonding material :
- AMKOR ATP (Philippines) copper palladium wire

Timing / schedule Intended start of delivery 2024-12-16
2025/02/28 PCN(Product Change Notice) ST Crolles (France) additional source for STM32G41x/G47x/G48x, STM32L43x/L44x/L4Zx and STM32L47x/L48x products in M10/90nm technology.
Click here for contact regarding final purchasing
PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

Product & Sales Information of products subject to notification

   12345  Last  NEXT
Products: 4,519 out of cases/Show 1 to 25






   12345  Last  NEXT
Products: 4,519 out of cases/Show 1 to 25