PCN/PDN/NRND Information STM32F746NEH6｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2025/02/17	PCN(Product Change Notice)	Supplier Notice No.:MDG/24/14375#1 Title: AMKOR ATP (Philippines) TFBGA package copper palladium bonding wire introduction on STM32F4x, STM32F7x, STM32G4x and STM32H7x listed products. Description of change: (Updated document) Old/ Current Wire bonding material: - MUAR (Malaysia) gold wire - ASE Kaohsiung (Taiwan) Gold or CuPd wire - AMKOR ATP (Philippines) gold wire New/ Current Wire bonding material: - MUAR (Malaysia) gold wire - ASE Kaohsiung (Taiwan) Gold or CuPd wire - AMKOR ATP (Philippines) gold wire New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire Anticipated Impact on form,fit,function, quality, reliability or processability? no impact on form, Fit, Function Intended start of delivery: 2025-02-17
2025/07/03	PCN(Product Change Notice)	PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(2/3) old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly
2025/08/12	PCN(Product Change Notice)	Supplier Notice No.:MICROCONTROLLERS/25/15304 Title:ST ROUSSET (France) additional source for STM32F75x/74x listed products in M10/90nm technology. Description: Old/ Front-end sources for Die 449 cut1.1 : - ST Crolles (France) CR300 revision Z - TSMC (Taiwan) FAB14 revision 1 New/ Front-end sources for Die 449 cut1.1 : - ST Crolles (France) CR300 revision Z - TSMC (Taiwan) FAB14 revision 1 Additional source - ST Rousset (France) RS8F revision 2 Anticipated Impact on form,fit,function, quality, reliability or processability? No change on Form, Fit or Function - same datasheet. Intended start of delivery: 2025-08-12
2025/08/12	PCN(Product Change Notice)	PCN No.:EMBEDDED PROCESSING/25/15304 Change Desc.:ST ROUSSET (France) additional source for STM32F75x/74x listed products in M10/90nm technology. Intended start of delivery: 2025-08-12
2025/11/07	PCN(Product Change Notice)	PCN No.: EMBEDDED PROCESSING/25/15422 Description: ASE KaoHsiung (Taiwan) additional source for STM32F74/75xx, STM32F76/77xx listed products in TFBGA 13X13 216L package and STM32F20/21xx, STM32F40/41xx, STM32F42/43xx listed products in UFBGA 10X10 176+25 package.
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PCN/PDN/NRND Information

Notification Type

Notification Information

Notification Date

Products subject to notification

Manufacturer	Manufacturer Part Number	Last Time Buy	Successor Products

Product & Sales Information of products subject to notification

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PCN/PDN Information
Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
For details regarding product specification changes or discontinuation, please ensure to check the manufacturer's official website.

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PCN/PDN/NRND Information

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