| 2023/12/20 |
|
PCN(Product Change Notice)
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Supplier Notice No.:MDG/23/14387 Title: AMKOR ATP (Philippines) - UBoT Carrier Tape & Cover Tape alternative packing material for TQFP14x14x1.4 package listed products.
Description of change: Old:KOSTAT carrier tape and cover tape. New:KOSTAT carrier tape and cover tape (until depletion of current material). Then UBoT carrier tape and cover tape.
Anticipated Impact on form,fit, function, quality, reliability or processability? no impact
Motivation: Alternate Tape & Reel material with more robust pockets design to further reduce risk of bent leads during reel handling
Intended start of delivery: 2023-12-20 |
| 2023/12/20 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:MDG/23/14387 Title: AMKOR ATP (Philippines) - UBoT Carrier Tape & Cover Tape alternative packing material for TQFP14x14x1.4 package listed products.
Description of change: Old:KOSTAT carrier tape and cover tape. New:KOSTAT carrier tape and cover tape (until depletion of current material). Then UBoT carrier tape and cover tape.
Anticipated Impact on form,fit, function, quality, reliability or processability? no impact
Motivation: Alternate Tape & Reel material with more robust pockets design to further reduce risk of bent leads during reel handling
Intended start of delivery: 2023-12-20 |
| 2024/08/22 |
|
PCN(Product Change Notice)
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Description of change Old : Current Wire bonding material: - ASEKH (Taiwan) gold wire - ASEKH (Taiwan) copper palladium wire. - AMKOR ATP (Philippines) gold wire
New : Current Wire bonding material: - ASEKH (Taiwan) gold wire - ASEKH (Taiwan) copper palladium wire. - AMKOR ATP (Philippines) gold wire New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire
Timing / schedule Intended start of delivery 2024-11-01 |
| 2024/08/28 |
|
PCN(Product Change Notice)
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Description Old: Current Wire bonding material: - ASEKH (Taiwan) gold wire - ASEKH (Taiwan) copper palladium wire. - AMKOR ATP (Philippines) gold wire New: Current Wire bonding material: - ASEKH (Taiwan) gold wire - ASEKH (Taiwan) copper palladium wire. - AMKOR ATP (Philippines) gold wire New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire
Timing / schedule Intended start of delivery 2024-11-01 |
| 2024/09/10 |
|
PCN(Product Change Notice)
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Description of change Old Current assembly sites: - ASE Kaohsiung (Taiwan) Gold wire & Copper Palladium wire - AMKOR ATP (Philippine) Gold wire & Copper Palladium wire New Current assembly site: - ASE Kaohsiung (Taiwan) Gold wire & Copper Palladium wire - AMKOR ATP (Philippine) Gold wire & Copper Palladium wire Additional assembly site for extended capacity: - ST Muar (Malaysia) Copper Alloy wire
Timing / schedule Intended start of delivery 2024-12-16 |
| 2025/03/28 |
|
PCN(Product Change Notice)
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Description of change Old: Bootloader V9.1 Known limitation Same data are output on the USART1_TX PB14 when using USART1 on PA10/PA9 Please refer to AN2606 Rev 65 - February 2025 New: New Boot loader version V9.2 is fixing the abnormal data output on the USART1_TX PB14 when using USART1 on PA10/PA9 Please refer to AN2606 Rev 66 - April 2025
Timing / schedule Intended start of delivery 2025-04-17 |
| 2025/07/03 |
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PCN(Product Change Notice)
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PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(3/3)
old/ Marking composition with no 2D marking
New/ New marking composition with 2D marking for production assembly |