| 2024/03/29 |
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PCN(Product Change Notice)
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Supplier Notice No.:CN-202302017F Title: Release of Cu-wire for ESD protection devices in SOD323 (BSOB)
Details of this change: - The bond wire material will be changed from gold (Au) to copper (Cu). - use of 200mm wafer materials. These wafer materials have been announced in CN-202001003F01 - related to use of these 200mm wafer materials, some other changes are introduced for affected products (die thickness, different back metal stack, change of die size and active area size) - Introduction of EMCs (epoxy mold compounds) GR646CHN and EME-E500HK.
Planned first shipment: 29 Mar 2024 |
| 2024/06/15 |
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PCN(Product Change Notice)
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Nexperia changes the finished goods label, this includes: - Readable text~orderable part number (OPN) on SPQ and PQ labels, (34P) - 2D matrix code on SPQ~label, embedded with packing unit identifier (PUID) data - Replace (31D) Redate~by (32D) Date1 for new re-date code definition - QR code on PQ label (for~internal use mainly) * Since there are many applicable products, this notification is divided and notified. Therefore, depending on your purchase history, notifications may be sent in multiple notifications, but the following notifications will all be the same. Our notification number: PP0000735569 / PP0000735597 |
| 2025/04/20 |
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PCN(Product Change Notice)
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INTRODUCTION OF NEW CARRIER TAPE FOR SOD323 AND NEW COVER TAPE FOR SOT223 |
| 2025/12/22 |
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PCN(Product Change Notice)
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PCN No.:CN-202512022I Change Desc.:Nexperia B.V. is forced to announce the unavailability of the entire SOD323 double die portfolio. Due to the force majeure situation, we have not been able to produce this package technology since October 13th, 2025, as it was solely sourced from China locations. For most parts we can offer drop-in replacement solutions.
Effective date: 22 Dec 2025 |