| 2020/02/04 |
|
PCN(Product Change Notice)
|
As part of continuous quality improvement program we will be converting the top mark from ink to laser on ADI (legacy Linear Tech) products in all 16-Lead MSOP packages assembled in ADPG and UTAC. |
| 2021/08/23 |
|
PCN(Product Change Notice)
|
Laser Top Mark for 16-Lead MSOP Packages Assembled in ADPG and UTAC. Adding additional parts LT8632, LT8365, LTC7803, LTC7804,LT1914. Reason For Change: Laser mark is more uniform, consistent and has better through put in assembly as compare to ink mark. The proposed change is applicable to all 16-Lead MSOP packages. |
| 2021/08/26 |
|
PCN(Product Change Notice)
|
ADI is transferring all products currently manufactured using the 0.35micron BCDprocess at thewafer fab facility located at 275 S. Hillview Dr., Milpitas, CA, USAto Vanguard International Semiconductor, Taiwan |
| 2024/06/05 |
|
PCN(Product Change Notice)
|
Epoxy formulation changefrom Henkel 8290 to Henkel 8290A. 8290A is a more robust epoxy with minimal outgassing due to its less volatile fluorocarbon content. |
| 2025/05/14 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:PCN 25_0017 Rev. - Title: Bond Wire Change from Gold to Copper
Description Of Change: Change of bond wire from Gold to Copper wire for LFCSP/SO/TSSOP/TSOT/SC70 pkg family built in UTAC (Thailand). LFCSP BOM will be changed from Sumitomo G770HCD/ Albestik8200 to Sumitomo G700/Ablestik8600. TSSOP Die attach will be changed from Ablestik8200 to Atrox 558. All materials have qualified and in production for ADI devices.
Reason For Change: The conversion to Cu wire aligns with industry trend and ADI current and future corporate directives.
Impact of the change (positive or negative) on fit, form, function & reliability: This change has no impact on fit, form, function & reliability.
Effectivity Date: 19-May-2025 (the earliest date that a customer could expect to receive changed material) |