Chip One Stop - Shopping Site for Electronic Components and Semiconductors
Menu
Spain
Change
English
SELECT YOUR LANGUAGE
USD
SELECT YOUR CURRENCY FOR DISPLAY
About Preferential Rank / Discount

Current price of Item(s) have been applied below.
 


・Preferential Rank and Discount rate will be applied according to your usage of our web service.
・Discount is only applicable to orders from chip1stop web site.
・Discounts may not be applicable to all products and may be subject to MOQ.
・Please contact your representative for details of Preferential Rank.
・No other coupons may be used in conjunction with this discount.

PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2020/03/10 PCN(Product Change Notice) JSCC capacity increase - for listed products
[Old]
Silver wire bonding

[New]
Silver wire bonding
Gold wire bonding
2021/01/08 PCN(Product Change Notice) PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2024/12/04 PCN(Product Change Notice) JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products
2025/02/03 PCN(Product Change Notice) Supplier Notice No.:PCN MDG/24/14976
Title:
JSCC (China) LQFP7x7 48L , LQFP10x10 64L package copper palladium bonding wire introduction on STM32F2x, STM32F4x and STM32F7x listed products

Description:
Old/
Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper
Palladium wire

New/
Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper
Palladium wire
Added Wire bonding material :
- JSCC (China) Copper Palladium wire

Anticipated Impact on form,fit,function, quality, reliability or processability?
no impact on form, Fit, Function

Intended start of delivery:
2025-02-03
2026/02/04 PCN(Product Change Notice) PCN No. EMBEDDED PROCESSING/25/15910
Change Desc.
ASE Kaohsiung (Taiwan) additional source for STM32F446x listed products in LQFP 10x10 64L package

Timing / schedule Intended start of delivery 2026-02-04
Click here for contact regarding final purchasing
PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

Product & Sales Information of products subject to notification

   12345  Last  NEXT
Products: 4,106 out of cases/Show 1 to 25






   12345  Last  NEXT
Products: 4,106 out of cases/Show 1 to 25