| 2021/05/14 |
|
PCN(Product Change Notice)
|
Qualify TI Malaysia as an additional Assembly site for Select Devices : Assembly Site / Assembly City TIEM / Kuala Lumpur Melaka > Melaka AP1 / Cupang, Muntinlupa City : no changed TI Malaysia / Ayutthaya > KualaLumpur |
| 2021/08/11 |
|
PCN(Product Change Notice)
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TI Malaysia (MLA) as an Additional Assembly site : Current assembly site and Material differences are as follows: _______MountCompound / MoldCompound / LeadFinish / ##Bondwire,diameter TIEM : 8075531 / 8096859 / Matte Sn / Au,1.3mils API : SID#101375281 / SID#101323397/ Matte Sn / Au,1.3mils MLA : 4147858 / 4211880 / NiPdAu / Cu,1.3mils |
| 2024/05/23 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:20240521000.0 Title: Marking Standardization for Select Devices
Description of Change: This notice is to communicate an update in the device symbolization format for the devices in the product.
Reason for Change: Marking Standardization
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): None |