PCN/PDN/NRND Information IRF4905PBF｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2021/01/27	PCN(Product Change Notice)	Change of wafer production location from Infineon Technologies Temecula, USA to EPISIL Technologies Inc., Taiwan for several Gen5.0 and Gen 7.0 MOSFET
2021/01/29	PCN(Product Change Notice)	Change of wafer production location from Infineon Technologies Temecula, USA to EPISIL Technologies Inc., Taiwan for several Gen5.0 and Gen 7.0 MOSFET
2021/02/26	PCN(Product Change Notice)	Manufacturer: Infineon Ref# : 1114-DISTI42-C4000343-PRIVATE Subject: INTRODUCTION OF TONGFU MICROELECTRONICS AS ALTERNATE ASSEMBLY SITE FOR TO220 MOSFET PRODUCTS
2021/03/21	PCN(Product Change Notice)	Capacity expansion with introduction of an additional assembly and final test location at Huayi Microelectronics Co., Ltd (HYME), China for dedicated TO220 3L MOSFET products in Gen 5.X/7.X/10.X
2021/08/15	PCN(Product Change Notice)	Harmonize and standardize the lot number format across all external production partners Old : Multiple lot number formats New : Standardized into a single 11 alphanumeric lot number format
2023/12/11	PCN(Product Change Notice)	Phase out of Kyocera KEG300 mold compound for several assembly locations and change of lead finish from tin dip to electro plating at Tijuana, Mexico for dedicated TO220-3 & TO247-3 products Reason To ensure continuity of mold compound supply due to Kyocera KEG300 end of life and to further ensure our product performance with lead-free electroplating finish Description Assembly materials:Mold compound Old: Kyocera KEG300 New: Sumitomo EME-E500 Assembly materials:Lead finish (Tijuana only) Old: Tin dip finish New: Lead-free electroplating finish Intended start of delivery 2024-02-29
2024/02/01	PCN(Product Change Notice)	Supplier Notice No.:PCN 2023-092-A Title: Change of the wafer production location from Infineon Technologies Temecula, USA to Infineon Technologies Kulim, Malaysia for dedicated G5 P-Channel MOSFET products Reason: The wafer production of the affected products will be extended to Infineon Technologies Kulim, according to global Infineon production strategy Impact of change: No Intended start of delivery: February 2024 or based on customer approval
2024/02/29	PCN(Product Change Notice)	Phase out of Kyocera KEG300 mold compound for several assembly locations and change of lead finish from tin dip to electro plating at Tijuana, Mexico for dedicated TO220-3 & TO247-3 products
2024/04/15	PCN(Product Change Notice)	Supplier Notice No.:2023-092-B Title: Change of the wafer production location from Infineon TechnologiesTemecula, USA to Infineon Technologies Kulim, Malaysia for dedicated G5 P-Channel MOSFET products. Reason: The wafer production of the affected products will be extended to Infineon Technologies Kulim, according to global Infineon production strategy. Impact of change: NO Intended start of delivery: 2024-04-15
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PCN/PDN/NRND Information

Notification Type

Notification Information

Notification Date

Products subject to notification

Manufacturer	Manufacturer Part Number	Last Time Buy	Successor Products

Product & Sales Information of products subject to notification

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Inventory Information ▼

: JP:Japan, HK:Hong Kong, US:United States
EU:Europe, AUS:Australia, Asia:Asia, NA:North America

Supplier Information ▼

: Sourced from manufacturers and authorized distributors

: Stocks of semiconductor sourced from authorized distributors

Product Information ▼

MOQ/SPQ

MOQ：: Minimum purchase quantity that can be ordered.
Please enter a number greater than the MOQ when ordering.

SPQ：: Number of units that can be ordered.
Please enter a quantity in multiples of the SPQ when ordering.

Reel Processing
It is a service that connects empty tape to both ends of a tape cut using a special tool, set the reel, and rewind it into the packaged form for delivery. It is made so that it can be set as is to a mounting machine. Processing is available from 100 pieces or more.
PCN/PDN Information
Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
For details regarding product specification changes or discontinuation, please ensure to check the manufacturer's official website.

Package type▼: Bulk:
Bulk is a package which the separete parts are packed in a bag, or packed individually.
Tape & Reel:
Tape & Reel is the unmodified original reel received from the manufacturer.
In case the MOQ is smaller than the manufacturer's standard package quantity, it will be cut tapes even if the package is shown as "Tape & Reel".
Cut tape:
Cut tape is a tape cut from an original reel. Cut tape does not contain a leader or trailer.
If you require a one continuous cut tape, please put your comment on your remarks.
For our supplier's stock, we are unable to ensure that the package will be one continuous cut tape even if you put your remark.

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Product Information ▼

: New Products released by manufacturers within 1 year

: New Products on Chip One Stop website within 3 months

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PCN/PDN/NRND Information

Product & Sales Information of products subject to notification