104652-5 TE Connectivity 기판 대 기판 커넥터 - 商品詳細情報
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Specifications
- Manufacturer name
- TE Connectivity
- Product name
- 104652-5
- Product classification
- 기판 대 기판 커넥터
- Lifecycle Status
- 양산중
- RoHS
- RoHS비대응
- 시리즈명
- AMPMODU 50/50 Grid
- 배열수
- 2
- 부품번호 별칭
- -1076-104652-5|1046525|A3104|2266-104652-5
- Connector Type
- Receptacle
- Contact Finish Thickness
- 0.76um
- Contact Material
- Copper Alloy
- Contact Mating Finish
- Gold
- Contact Shape
- Square
- Contact Type
- Female Socket
- Contact(Post) Finish
- Tin-Lead
- Fastening Type
- Push-Pull
- Insulation Color
- Black
- Insulation Height
- 4.75mm
- Insulation Material
- Liquid Crystal Polymer (LCP)
- Mated Stacking Heights
- 6.35|8.13|9.91mm
- Number of Positions Loaded
- All
- Style
- Board to Board or Cable
- 동작 온도 범위
- -65 to 105C
- 설치
- Surface Mount
- 열 간격(결합)
- 1.27mm
- 종단
- Solder
- 특징
- Board Lock
- 포지션수
- 50
- 피치(결합)
- 1.27mm
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