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우대 스테이지/할인율에 대하여

현재 상품 가격은 할인된 가격으로 표시되고 있습니다.


・고객님의 이용 상황에 따라 우대 스테이지와 할인율이 적용됩니다.
・할인에 관해서는 당 WEB 사이트에서의 직접 주문에 한합니다.
・일부 우대 스테이지 대상 할인 적용이 안되는 제품과 수량이 있습니다.
・우대 스테이지의 자세한 내용은 고객 담당자에게 확인하시기 바랍니다.
・기타 할인과 함께 사용할 수 없습니다.

PCN/PDN/NRND 정보

PCN (제품/프로세스 변경 통지) 및 PDN (제품 단종 통지) 정보입니다.

통지일 통지 문서 통지 종류 통지 정보
2021/01/08 PCN (제품 변경 통지) PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2022/04/24 PCN (제품 변경 통지) Setup of a 2nd EMEA DC in Frankfurt for closer deliveries to customers in
Germany & Eastern Europe. The change also includes personnel, location,
logistic model..
2022/05/08 PCN (제품 변경 통지) NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08
2022/05/15 PCN (제품 변경 통지) Notification related for 2nd EMEA DC project in Frankfurt
2025/02/17 PCN (제품 변경 통지) Supplier Notice No.:MDG/24/14375#1
Title:
AMKOR ATP (Philippines) TFBGA package copper palladium bonding wire introduction on STM32F4x, STM32F7x, STM32G4x and STM32H7x listed products.

Description of change:
(Updated document)
Old/
Current Wire bonding material:
- MUAR (Malaysia) gold wire
- ASE Kaohsiung (Taiwan) Gold or CuPd wire
- AMKOR ATP (Philippines) gold wire

New/
Current Wire bonding material:
- MUAR (Malaysia) gold wire
- ASE Kaohsiung (Taiwan) Gold or CuPd wire
- AMKOR ATP (Philippines) gold wire
New Wire bonding material :
- AMKOR ATP (Philippines) copper palladium wire

Anticipated Impact on form,fit,function, quality, reliability or processability?
no impact on form, Fit, Function

Intended start of delivery:
2025-02-17
2025/07/03 PCN (제품 변경 통지) PCN No.:MICROCONTROLLERS/25/15246
Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed
products(1/3)

old/
Marking composition with no 2D marking

New/
New marking composition with 2D marking for
production assembly
2025/07/18 PCN (제품 변경 통지) PCN No. CRP/25/15294
Change Desc.
Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)

Timing / schedule Intended start of delivery 2025-08-18
2025/08/12 PCN (제품 변경 통지) Supplier Notice No.:MICROCONTROLLERS/25/15304
Title:ST ROUSSET (France) additional source for STM32F75x/74x listed products in M10/90nm technology.

Description:
Old/
Front-end sources for Die 449 cut1.1 :
- ST Crolles (France) CR300 revision Z
- TSMC (Taiwan) FAB14 revision 1

New/
Front-end sources for Die 449 cut1.1 :
- ST Crolles (France) CR300 revision Z
- TSMC (Taiwan) FAB14 revision 1 Additional source
- ST Rousset (France) RS8F revision 2

Anticipated Impact on form,fit,function, quality, reliability or processability?
No change on Form, Fit or Function - same datasheet.

Intended start of delivery:
2025-08-12
2025/08/12 PCN (제품 변경 통지) PCN No.:EMBEDDED PROCESSING/25/15304
Change Desc.:ST ROUSSET (France) additional source for STM32F75x/74x listed products in M10/90nm
technology.

Intended start of delivery:
2025-08-12
2025/11/07 PCN (제품 변경 통지) PCN No.: EMBEDDED PROCESSING/25/15422
Description: ASE KaoHsiung (Taiwan) additional source for STM32F74/75xx, STM32F76/77xx listed products in TFBGA 13X13 216L package and STM32F20/21xx, STM32F40/41xx, STM32F42/43xx listed products in UFBGA 10X10 176+25 package.
최종 구매(last buy) 상담
PCN/PDN/NRND 정보
통지 종류
통지 정보
통지일
대상 제품
제조사 품번 마지막 주문 가능일 후속 제품

PCN/PDN 대상제품 정보

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   12345  마지막  다음
해당건수:5,723 건 중 / 1~25(을)를 표시