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현재 상품 가격은 할인된 가격으로 표시되고 있습니다.


・고객님의 이용 상황에 따라 우대 스테이지와 할인율이 적용됩니다.
・할인에 관해서는 당 WEB 사이트에서의 직접 주문에 한합니다.
・일부 우대 스테이지 대상 할인 적용이 안되는 제품과 수량이 있습니다.
・우대 스테이지의 자세한 내용은 고객 담당자에게 확인하시기 바랍니다.
・기타 할인과 함께 사용할 수 없습니다.

PCN/PDN/NRND 정보

PCN (제품/프로세스 변경 통지) 및 PDN (제품 단종 통지) 정보입니다.

통지일 통지 문서 통지 종류 통지 정보
2021/08/26 PCN (제품 변경 통지) Scheduled changes affect ESD protection devices in SOT23. These include:
- bond wire material wil be changed from gold (Au) to copper (Cu).
Gold wire remains qualified for supply security reason
- for some products, 200mm wafers will be introduced in additional to currently released 150mm wafers
- for some products, new die design and back side metallization will be implemented
2021/08/26 PCN (제품 변경 통지) Scheduled changes affect ESD protection devices in SOT23. These include:
- bond wire material wil be changed from gold (Au) to copper (Cu).
Gold wire remains qualified for supply security reason
- for some products, 200mm wafers will be introduced in additional to currently released 150mm wafers
- for some products, new die design and back side metallization will be implemented
2023/11/10 PCN (제품 변경 통지) Release of 200mm wafer diameter and new EMCs for double ESD protection diodes~in SOT23
2023/12/04 PCN (제품 변경 통지) Supplier Notice No.:CN-202208014F
Title:
Release of 200mm wafer diameter and new EMCs for double ESD protection diodes in SOT23

Details of this change:
Old products:
Production using 150mm wafer diameter. As EMC, GR646 is used.

Changed products:
Production using 150 and 200mm wafer diameter.
In addition, E500HK, GR646CHN and CV4112 will be used.

Why do we implement this change?
- Improved supply situation by capacity expansion in the wafer fab
- State of the Art technology by continuous alignment with world class technology trends -
Increased flexibility and improved volume ramp-up

Impact:
No impact to the product's functionality anticipated

Planned first shipment:
04 Dec 2023
2024/01/07 PCN (제품 변경 통지) Introduction of new carrier tape material in SOT23
A new surface material for carrier tapes for the package SOT23 will be introduced as second source:
Polystyrene (PS) in addition to Polycarbonate (PC).
The cover tape material will remain unchanged.

Since there are many applicable products, this notification is divided into individual notifications.
Depending on your company's purchase history, you may receive multiple notifications.
Please be aware.
2024/06/15 PCN (제품 변경 통지) Nexperia changes the finished goods label, this includes: - Readable text~orderable part number (OPN) on SPQ and PQ labels, (34P) - 2D matrix code on SPQ~label, embedded with packing unit identifier (PUID) data - Replace (31D) Redate~by (32D) Date1 for new re-date code definition - QR code on PQ label (for~internal use mainly)
* Since there are many applicable products, this notification is divided and notified. Therefore, depending on your purchase history, notifications may be sent in multiple notifications, but the following notifications will all be the same.
Our notification number: PP0000735569 / PP0000735597
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PCN/PDN/NRND 정보
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PCN/PDN 대상제품 정보

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해당건수:4,229 건 중 / 1~25(을)를 표시