| 2020/09/08 |
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PCN (제품 변경 통지)
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PRODUCT CHANGE NOTIFICATION |
| 2020/09/09 |
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PCN (제품 변경 통지)
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PRODUCT CHANGE NOTIFICATION |
| 2020/10/01 |
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PCN (제품 변경 통지)
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MCU/SOC (GP products) announcement of Full carton |
| 2021/04/01 |
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PCN (제품 변경 통지)
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RE-PROCESSED to include LTB Date to 4/01/2021 for packing change from Fractional Tray to Full Carton : Shipments from REA of devices in Full Cartons begins. October 1, 2020 |
| 2021/04/01 |
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PCN (제품 변경 통지)
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RE-PROCESSED to include LTB Date to 4/01/2021 for packing form with a tray from fraction to Full Carton (full packing) : Full Carton shipment will become standard, combining max. 3 lot codes worst case |
| 2022/11/01 |
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PCN (제품 변경 통지)
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Assembly materials change for RA/SYNERGY family LQFP package products. For the listed Renesas RA family and SYNERGY family products, the lead frame material will be changed, and the mold compound will be added. Effective Date: 11/1/2022 |
| 2022/11/01 |
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PCN (제품 변경 통지)
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Assembly materials change for RA/SYNERGY family LQFP package products. For the listed Renesas RA family and SYNERGY family products, the lead frame material will be changed, and the mold compound will be added. Effective Date: 11/1/2022 |
| 2022/11/01 |
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PCN (제품 변경 통지)
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Change of lead frame material, addition of mold compound Change Implementation 1. Nov. 2022 onwards |
| 2024/10/01 |
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PCN (제품 변경 통지)
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Supplier Notice No.:EE-QR-240625-01 Title: Renesas will add full tray packaging to MCU products in addition to fractional and full carton.
Description of Change: Renesas will add full tray packaging to MCU products in addition to fractional and full carton. The standard shipping packaging using Renesas trays is a full carton (complete packaging). However, if the customer's order quantity is less than a full carton, we will change it to the full tray that will be added this time.
Reason for Change: Stable supply of products, environmentally friendly response (improving packaging resource usage efficiency, reducing waste amount)
Schedules: Change Implementation: 1. October 2024 |