| 2021/01/08 |
|
PCN (제품 변경 통지)
|
PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2021/03/11 |
|
PCN (제품 변경 통지)
|
AMKOR ATP (Philippines) enhanced Die Attach (new material) - All listed product in UFBGA package |
| 2021/06/15 |
|
PCN (제품 변경 통지)
|
Old> marking composition with no SS marking
New> marking composition with additional SS marking
|
| 2021/07/29 |
|
PCN (제품 변경 통지)
|
Die redesign: Mask or mask set change with new die design
- Design changes in active elements.
Manufacturing Location
TSMC Fab14 (Taiwan)/ Crolles (France)
Old
Current Die revision:
- STM32F46X 1MB rev2 (Cut 1.3) in ST Crolles CRL300 (France)
- STM32F46X 1MB rev4 (Cut 1.3) in TSMC Fab14 (Taiwan)
Current RM0090 Rev 8 - Reference Manual
STM32F405/415, STM32F407/417, STM32F427/437
and STM32F429/439 advanced ArmR-based 32-bit MCUs
New
New Die Revision to improve manufacturing efficiency:
- STM32F46X 1MB rev6 (Cut 1.4) in ST Crolles CRL300 (France)
- STM32F46X 1MB rev5 (Cut 1.4) in TSMC Fab14 (Taiwan)
New RM0090 Rev 19 - Reference Manual - february 2021
STM32F405/415, STM32F407/417, STM32F427/437
and STM32F429/439 advanced ArmR-based 32-bit MCUs
Timing / schedule
Date of qualification results 2021-05-14
Intended start of delivery 2021-12-22 |
| 2021/08/30 |
|
PCN (제품 변경 통지)
|
- Specification Change
OLD
Refer to application Note AN2606 version 48.0 April 2021 :
- STM32F40xxx/41xxx devices in WLCSP90 package have Bootloader version V9.0.
- STM32F40xxx/41xxx devices in all other packages have Bootloader version V3.1.
NEW
Refer to application Note AN2606 version 49.0 July 2021 :
- All STM32F40xxx/41xxx devices in any package with new BootLoader version V9.1 |
| 2021/08/30 |
|
PCN (제품 변경 통지)
|
STM32F46X 1MB product BootLoader improvement
Product Category: STM32F46X 1MB
Issue date 2021-07-13
Description
Old
Refer to application Note AN2606 version 48.0 April 2021 :
- STM32F40xxx/41xxx devices in WLCSP90
package have Bootloader version V9.0.
- STM32F40xxx/41xxx devices in all other
packages have Bootloader version V3.1.
New
Refer to application Note AN2606 version 49.0 July 2021 :
- All STM32F40xxx/41xxx devices in any
package with new BootLoader version V9.1
Intended start of delivery 2021-08-30 |
| 2021/08/30 |
|
PCN (제품 변경 통지)
|
Specification Change
STM32F46X 1MB product BootLoader improvement
Description
Refer to application Note AN2606 version 49.0 July 2021
- All STM32F40xxx/41xxx devices in any
package with new BootLoader version V9.1
Intended start of delivery 2021-08-30 |
| 2021/12/22 |
|
PCN (제품 변경 통지)
|
Die redesign: Mask or mask set change with new die design - Design changes in active elements.
Description of change:
OLD:
Current Die revision:
- STM32F46X 1MB rev2 (Cut 1.3) in ST Crolles CRL300 (France)
- STM32F46X 1MB rev4 (Cut 1.3) in TSMC Fab14 (Taiwan)
Current RM0090 Rev 8 - Reference Manual
STM32F405/415, STM32F407/417,
STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs.
New:
New Die Revision to improve manufacturing efficiency:
- STM32F46X 1MB rev6 (Cut 1.4) in ST Crolles CRL300 (France)
- STM32F46X 1MB rev5 (Cut 1.4) in TSMC Fab14 (Taiwan)
New RM0090 Rev 19 - Reference Manual -february 2021
STM32F405/415, STM32F407/417,
STM32F427/437 and STM32F429/439 advanced ArmR-based 32-bit MCUs
Intended start of delivery 2021-12-22 |
| 2022/03/31 |
|
PCN (제품 변경 통지)
|
Wire Bond Method/Material Change
Description of change
Old: ASE Kaohsiung back-end: - Gold wire bonding assembly line
New: ASE Kaohsiung back-end :- Gold wire bonding assembly line
- New Copper Palladium added assembly line
Intended start of delivery 2022-03-31 |
| 2022/04/24 |
|
PCN (제품 변경 통지)
|
Setup of a 2nd EMEA DC in Frankfurt for closer deliveries to customers in
Germany & Eastern Europe. The change also includes personnel, location,
logistic model.. |
| 2022/05/08 |
|
PCN (제품 변경 통지)
|
NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08 |
| 2022/05/15 |
|
PCN (제품 변경 통지)
|
Notification related for 2nd EMEA DC project in Frankfurt |
| 2022/06/04 |
|
PCN (제품 변경 통지)
|
-New Die Revision to improve manufacturing efficiency and New RM0090 Rev 19 -
Reference Manual |
| 2023/08/28 |
|
PCN (제품 변경 통지)
|
ASE Kaohsiung (Taiwan)
- qualification of a second source substrate supplier (SCC - Shennan Circuit Company)
for BGA package, size from BGA5x5 to BGA18x18, for listed products
Old
First source Supplier, either ASEMTL-SH or TCI or Kinsus or Nanya is used over the different
impacted products.
New
First source remains either ASEMTL-SH or TCI or Kinsus or Nanya depending on the product.
Second source supplier SCC for all impacted products.
Timing / schedule Intended start of delivery 2023-09-06 |
| 2024/10/09 |
|
PCN (제품 변경 통지)
|
Description of change
Old : Current Wire bonding material:
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) gold and Copper Palladium wire.
New : Current Wire bonding material:
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) gold and Copper Palladium wire.
New Wire bonding material :
- AMKOR ATP (Philippines) copper palladium wire
Timing / schedule Intended start of delivery 2024-12-16 |
| 2025/01/15 |
|
PCN (제품 변경 통지)
|
Supplier Notice No.:PCI MDG/24/15095
Title:
AMKOR ATP (Philippines) Enhanced traceability with 2D marking for UFBGA7x7 and UFBGA10x10 listed products ? (Addendum to PCN14374)
Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly
Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change
Intended start of delivery:
2025-01-15 |
| 2025/07/03 |
|
PCN (제품 변경 통지)
|
PCN No.:MICROCONTROLLERS/25/15246
Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed
products(2/3)
old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for
production assembly |
| 2025/11/07 |
|
PCN (제품 변경 통지)
|
PCN No.: EMBEDDED PROCESSING/25/15422
Description: ASE KaoHsiung (Taiwan) additional source for STM32F74/75xx, STM32F76/77xx listed products in TFBGA 13X13 216L package and STM32F20/21xx, STM32F40/41xx, STM32F42/43xx listed products in UFBGA 10X10 176+25 package. |
