| 2020/03/10 |
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PCN (제품 변경 통지)
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JSCC capacity increase - for listed products [Old] Silver wire bonding
[New] Silver wire bonding Gold wire bonding |
| 2020/06/12 |
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PCN (제품 변경 통지)
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For StatsChipPAC JSCC Jiangyin China capacity increase Silver wire bonding > Silver wire bonding + Gold wire bonding |
| 2021/01/08 |
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PCN (제품 변경 통지)
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PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2022/05/08 |
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PCN (제품 변경 통지)
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NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |
| 2022/05/08 |
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PCN (제품 변경 통지)
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Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule Intended start of delivery 2022-05-08 |
| 2025/07/18 |
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PCN (제품 변경 통지)
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PCN No. CRP/25/15294 Change Desc. Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)
Timing / schedule Intended start of delivery 2025-08-18 |