| 2020/03/10 |
|
PCN (제품 변경 통지)
|
JSCC capacity increase - for listed products
[Old]
Silver wire bonding
[New]
Silver wire bonding
Gold wire bonding |
| 2020/06/12 |
|
PCN (제품 변경 통지)
|
For StatsChipPAC JSCC Jiangyin China capacity increase
Silver wire bonding > Silver wire bonding + Gold wire bonding |
| 2021/01/08 |
|
PCN (제품 변경 통지)
|
PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2021/12/20 |
|
PCN (제품 변경 통지)
|
STM32F209 1Mb product improvement
Description of change
Old
Current die revision:
- STM32F209 1MB rev2 (Cut 2.4) in ST Crolles CRL300 (France)
- STM32F209 1MB rev3 (Cut 2.5) in TSMC Fab14 (Taiwan)
Current RM0033 Rev 8 - Reference Manual
STM32F205xx, STM32F207xx, STM32F215xx
and STM32F217xx advanced Arm-based 32-bit MCUs
New
New die revision to improve manufacturing efficiency:
- STM32F209 1MB rev5 (Cut 2.6) in ST Crolles CRL300 (France)
- STM32F209 1MB rev4 (Cut 2.6) in TSMC Fab14 (Taiwan)
New RM0033 Rev 9 - Reference Manual - february 2021
STM32F205xx, STM32F207xx, STM32F215xx
and STM32F217xx advanced Arm-based 32-bit MCUs
Anticipated Impact on form,fit,
function, quality, reliability or processability?
No impact on Form, Fit or Function
Timing / schedule
Date of qualification results 2021-05-14
Intended start of delivery 2021-12-20 |
| 2021/12/20 |
|
PCN (제품 변경 통지)
|
Die redesign: Mask or mask set change with new die design
- Design changes in active elements.
Manufacturing Location:
TSMC Fab14 (Taiwan)/ Crolles(France)
Current die revision:
- STM32F209 1MB rev2 (Cut 2.4) in ST Crolles CRL300 (France)
- STM32F209 1MB rev3 (Cut 2.5) in TSMC Fab14 (Taiwan)
Current RM0033 Rev 8
- Reference Manual STM32F205xx, STM32F207xx, STM32F215xx
and STM32F217xx advanced Arm-based 32-bit MCUs
New die revision to improve manufacturing efficiency:
- STM32F209 1MB rev5 (Cut 2.6) in ST Crolles CRL300 (France)
- STM32F209 1MB rev4 (Cut 2.6) in TSMC Fab14 (Taiwan)
New RM0033 Rev 9 - Reference Manual - february 2021
STM32F205xx, STM32F207xx, STM32F215xx
and STM32F217xx advanced Arm-based 32-bit MCUs
Timing / schedule
Date of qualification results 2021-05-14
Intended start of delivery 2021-12-20 |
| 2022/05/08 |
|
PCN (제품 변경 통지)
|
NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08 |
| 2023/05/15 |
|
PCN (제품 변경 통지)
|
ASE KaoHsiung (Taiwan) LQFP7x7, LQFP10x10, LQFP14x14 and LQFP20x20 package
copper palladium bonding wire introduction on STM32F2/F4/F7x, STM32G0/G4x, STM32L4/L5x
and STM32H5/H7x listed products
Timing / schedule Intended start of delivery 2023-05-15 |
| 2025/02/03 |
|
PCN (제품 변경 통지)
|
Supplier Notice No.:PCN MDG/24/14976
Title:
JSCC (China) LQFP7x7 48L , LQFP10x10 64L package copper palladium bonding wire introduction on STM32F2x, STM32F4x and STM32F7x listed products
Description:
Old/
Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper
Palladium wire
New/
Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- AMKOR ATP (Philippines) gold wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper
Palladium wire
Added Wire bonding material :
- JSCC (China) Copper Palladium wire
Anticipated Impact on form,fit,function, quality, reliability or processability?
no impact on form, Fit, Function
Intended start of delivery:
2025-02-03 |
| 2025/04/15 |
|
PCN (제품 변경 통지)
|
Supplier Notice No.:MICROCONTROLLERS/25/15166
Title:
JSCC (China) - KOSTAT Carrier Tape & Cover Tape alternative packing material for TQFP7x7 & QFP10x10 package on listed products.
Description of change:
Old/
For QFP7X7, QFP10X10 packages
- E-PAK carrier tape and cover tape
New/
For QFP7X7 & QFP10X10 packages
- E-PAK carrier tape and cover tape (until depletion of current material).
- Then KOSTAT carrier tape (4-side partial fence) and cover tape.
Intended start of delivery:
2025-04-15 |
| 2025/05/20 |
|
PCN (제품 변경 통지)
|
ASE KaoHsiung (Taiwan) additional source for legacy STM32F2x, STM32F4x and STM32F7x
Description of change
Old Current assembly sites (depending on package/product):
- ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice,
- AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice,
- AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice,
- ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice,
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice,
- JSCC (China) Gold for Crolles, TSMC & Rousset Dice,
- JSCC (China) Copper Palladium wire for Crolles, TSMC Dice.
You may refer to 15271_Additional
information.pdf document for further details.
New Current assembly sites: (depending on package/product):
- ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice,
- AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice,
- AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice,
- ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice,
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice,
- JSCC (China) Gold for Crolles, TSMC & Rousset Dice,
- JSCC (China) Copper Palladium wire for Crolles, TSMC Dice.
Additional assembly site for extended capacity:
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Rousset Dice.
|
| 2025/07/03 |
|
PCN (제품 변경 통지)
|
PCN No.:MICROCONTROLLERS/25/15246
Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed
products(2/3)
old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for
production assembly |
| 2025/12/15 |
|
PCN (제품 변경 통지)
|
PCN No.:EMBEDDED PROCESSING/25/15423
Change Desc.:JSCC (China) additional source for legacy STM32F2x and STM32F4x listed products in LQFP
10x10 64L package
Intended start of delivery:
2025-12-15 |
