| 2021/10/07 |
|
PCN (제품 변경 통지)
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GLWO Labeling and Printing Rollout Project (Category 1 label design enhancement)
Description of change
Old Due to the technical limitation of the printing solution,
customized Labels containing a 2D barcode using the QR code format
is printing an extra text line which is displaying the QR code contents.
This is extra text line is not requested and is not used by the customer.
New The customized labels will be printed using the new labelling printing application.
The customized labels pasted on the inner boxes or outer boxes that
are using the QR codes format will no longer contain an extra text line.
The sequence of information and fields remain the same with respect to customer specifications. |
| 2022/05/08 |
|
PCN (제품 변경 통지)
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NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08 |
| 2022/11/23 |
|
PCN (제품 변경 통지)
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ST MUAR Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10 & LQFP14x14
Timing / schedule Intended start of delivery 2022-11-23 |
| 2023/03/04 |
|
PCN (제품 변경 통지)
|
ASE KaoHsiung (Taiwan) LQFP7x7, LQFP10x10, LQFP14x14 and LQFP20x20 package~copper palladium bonding wire introduction. |
| 2023/05/15 |
|
PCN (제품 변경 통지)
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ASE KaoHsiung (Taiwan) LQFP7x7, LQFP10x10, LQFP14x14 and LQFP20x20 package
copper palladium bonding wire introduction on STM32F2/F4/F7x, STM32G0/G4x, STM32L4/L5x
and STM32H5/H7x listed products
Timing / schedule Intended start of delivery 2023-05-15 |
| 2023/05/16 |
|
PCN (제품 변경 통지)
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ASE KaoHsiung (Taiwan) additional source - PCN10689 information alignment
- Second level interconnect (e4) or
Lead finishing material information actualized for AMKOR ATP (Philippines)
for LQFP 100 14x14 package products |
| 2023/06/20 |
|
PCN (제품 변경 통지)
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AMKOR ATP (Philippines) LQFP100 14x14 and LQFP144 20x20 Copper wire introduction and
standardization to post plated leadframes on listed products
Old: gold wire bonding Pre-plated leadframes (PPF)
New: copper palladium wire bonding post plated leadframe (DR) |
| 2023/06/24 |
|
PCN (제품 변경 통지)
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AMKOR ATP (Philippines) LQFP100 14x14 and LQFP144 20x20 Copper wire~introduction and standardization to post plated leadframes on listed products |
| 2024/09/02 |
|
PCN (제품 변경 통지)
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Supplier Notice No.:24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products
Description of change:
Old/Marking composition with no 2D marking
New/New marking composition with 2D marking for production assembly
Motivation:
to enhance traceability
Intended start of delivery:
2024-09-02 |
| 2025/05/20 |
|
PCN (제품 변경 통지)
|
ASE KaoHsiung (Taiwan) additional source for legacy STM32F2x, STM32F4x and STM32F7x
Description of change
Old Current assembly sites (depending on package/product):
- ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice,
- AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice,
- AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice,
- ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice,
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice,
- JSCC (China) Gold for Crolles, TSMC & Rousset Dice,
- JSCC (China) Copper Palladium wire for Crolles, TSMC Dice.
You may refer to 15271_Additional
information.pdf document for further details.
New Current assembly sites: (depending on package/product):
- ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice,
- AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice,
- AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice,
- ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice,
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice,
- JSCC (China) Gold for Crolles, TSMC & Rousset Dice,
- JSCC (China) Copper Palladium wire for Crolles, TSMC Dice.
Additional assembly site for extended capacity:
- ASE Kaohsiung (Taiwan) Copper Palladium wire for Rousset Dice.
|
| 2025/07/03 |
|
PCN (제품 변경 통지)
|
PCN No.:MICROCONTROLLERS/25/15246
Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed
products(1/3)
old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for
production assembly |
| 2025/07/18 |
|
PCN (제품 변경 통지)
|
PCN No. CRP/25/15294
Change Desc.
Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)
Timing / schedule Intended start of delivery 2025-08-18 |
| 2025/09/02 |
|
PCN (제품 변경 통지)
|
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products |
| 2025/09/02 |
|
PCN (제품 변경 통지)
|
Supplier Notice No.:MDG/24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14,LQFP20x20 & LQFP24x24 listed products
Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly
Motivation:
to enhance traceability
Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change
Intended start of delivery:
2025-09-02
|
