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  2. PCN/PDN/NRND 정보

PCN/PDN/NRND 정보

PCN (제품/프로세스 변경 통지) 및 PDN (제품 단종 통지) 정보입니다.

통지일 통지 문서 통지 종류 통지 정보
2020/09/11 PCN (제품 변경 통지) ASE Kaohsiung (Taiwan) additional source for TFBGA14x14 for STM32H75 2MB products
[Old]
Back-end sources:
- Amkor ATP Philippines

[New]
Back-end sources:
- Amkor ATP Philippines
- ASE Kaohsiung Taiwan
- Additional source
2021/01/08 PCN (제품 변경 통지) PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2022/09/22 PCN (제품 변경 통지) STM32H74x & STM32H75x 2MB product BootLoader & secure firmware improvement
Timing / schedule Intended start of delivery : 2022-09-22
2023/08/28 PCN (제품 변경 통지) ASE Kaohsiung (Taiwan)
- qualification of a second source substrate supplier (SCC - Shennan Circuit Company)
for BGA package, size from BGA5x5 to BGA18x18, for listed products

Old
First source Supplier, either ASEMTL-SH or TCI or Kinsus or Nanya is used over the different
impacted products.
New
First source remains either ASEMTL-SH or TCI or Kinsus or Nanya depending on the product.
Second source supplier SCC for all impacted products.

Timing / schedule Intended start of delivery 2023-09-06
2024/05/21 PCN (제품 변경 통지) Description of change
Old Assembly lines / wire bonding:
- AMKOR (Philippines) / Gold wire
- ASE Kaohsiung (Taiwan) / Gold wire
New Assembly lines / wire bonding:
- AMKOR (Philippines) / Gold wire
- ASE Kaohsiung (Taiwan) / Gold wire
- ASE Kaohsiung (Taiwan) / Copper Palladium wire
- Additional Source

Timing / schedule Intended start of delivery 2024-06-05
2025/02/17 PCN (제품 변경 통지) Supplier Notice No.:MDG/24/14375#1
Title:
AMKOR ATP (Philippines) TFBGA package copper palladium bonding wire introduction on STM32F4x, STM32F7x, STM32G4x and STM32H7x listed products.

Description of change:
(Updated document)
Old/
Current Wire bonding material:
- MUAR (Malaysia) gold wire
- ASE Kaohsiung (Taiwan) Gold or CuPd wire
- AMKOR ATP (Philippines) gold wire

New/
Current Wire bonding material:
- MUAR (Malaysia) gold wire
- ASE Kaohsiung (Taiwan) Gold or CuPd wire
- AMKOR ATP (Philippines) gold wire
New Wire bonding material :
- AMKOR ATP (Philippines) copper palladium wire

Anticipated Impact on form,fit,function, quality, reliability or processability?
no impact on form, Fit, Function

Intended start of delivery:
2025-02-17
2025/03/28 PCN (제품 변경 통지) Description of change
Old: Bootloader V9.1 Known limitation Same data are output on the USART1_TX PB14 when using USART1 on PA10/PA9
Please refer to AN2606 Rev 65 - February 2025
New: New Boot loader version V9.2 is fixing the abnormal data output on the USART1_TX PB14
when using USART1 on PA10/PA9
Please refer to AN2606 Rev 66 - April 2025

Timing / schedule Intended start of delivery 2025-04-17
2025/07/03 PCN (제품 변경 통지) PCN No.:MICROCONTROLLERS/25/15246
Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed
products(2/3)

old/
Marking composition with no 2D marking

New/
New marking composition with 2D marking for
production assembly
2025/12/15 PCN (제품 변경 통지) PCN No.:EMBEDDED PROCESSING/25/15272
Change Desc.:Chinese Supply Chain, as additional source, for STM32H75x/74x products in BGA packages.

Reason / motivation for change:
Due to the success on the market of STM32 devices, ST Microcontrollers Division decided to
qualify an additional front-end site to maintain state of the art service level to our customers
thanks to extra capacity.

Intended start of delivery:
2025-12-15
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PCN/PDN/NRND 정보
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