| 2025/04/25 |
|
PCN(Product Change Notice)
|
Qualification of MTAI as a new final test location for selected ATF22V10C, ATF750LVC, ATF750CL, ATF750C, ATF22LV10CQZ, ATF22V10CQZ, ATF22LV10C, and ATF22V10CQ device families available in 28L PLCC (11.5x11.5x4.4mm) package.
Pre and Post Summary Changes: Final Test Site Pre Change : Microchip Technology Operations (Phils.) Corp. (MPHL) Post Change : Microchip Technology Thailand (HQ) (MTAI)
Estimated Qualification Completion Date: June 2025
|
| 2025/07/22 |
|
PCN(Product Change Notice)
|
PCN No.: CENO-16EGCZ399 Description: CCBs 7684, 7686, 7703, 7704, 6429.001 and 7042.001 Final Notice: Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites. *As there are many affected products, we will inform you the model numbers by divided notifications. This is the 6/9th notification. |