| 2021/01/08 |
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PCN(Product Change Notice)
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PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2022/05/08 |
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PCN(Product Change Notice)
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NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |
| 2022/09/22 |
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PCN(Product Change Notice)
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STM32H74x & STM32H75x 2MB product BootLoader & secure firmware improvement Timing / schedule Intended start of delivery : 2022-09-22 |
| 2023/05/16 |
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PCN(Product Change Notice)
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ASE KaoHsiung (Taiwan) additional source - PCN10689 information alignment - Second level interconnect (e4) or Lead finishing material information actualized for AMKOR ATP (Philippines) for LQFP 100 14x14 package products |
| 2023/09/13 |
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PCN(Product Change Notice)
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ASE KaoHsiung (Taiwan) LQFP 100 14x14 package copper palladium bonding wire introduction on STM32H74x, STM32H75x, STM32G47x and STM32G48x
Old Back-end source: - AMKOR ATP (Philippines) gold wire New Back-end source: - AMKOR ATP (Philippines) gold wire - ASE KaoHsiung (Taiwan) copper palladium wire - additional source
Timing / schedule Intended start of delivery 2023-10-05 |
| 2023/12/20 |
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PCN(Product Change Notice)
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Supplier Notice No.:MDG/23/14387 Title: AMKOR ATP (Philippines) - UBoT Carrier Tape & Cover Tape alternative packing material for TQFP14x14x1.4 package listed products.
Description of change: Old:KOSTAT carrier tape and cover tape. New:KOSTAT carrier tape and cover tape (until depletion of current material). Then UBoT carrier tape and cover tape.
Anticipated Impact on form,fit, function, quality, reliability or processability? no impact
Motivation: Alternate Tape & Reel material with more robust pockets design to further reduce risk of bent leads during reel handling
Intended start of delivery: 2023-12-20 |
| 2023/12/20 |
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PCN(Product Change Notice)
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Supplier Notice No.:MDG/23/14387 Title: AMKOR ATP (Philippines) - UBoT Carrier Tape & Cover Tape alternative packing material for TQFP14x14x1.4 package listed products.
Description of change: Old:KOSTAT carrier tape and cover tape. New:KOSTAT carrier tape and cover tape (until depletion of current material). Then UBoT carrier tape and cover tape.
Anticipated Impact on form,fit, function, quality, reliability or processability? no impact
Motivation: Alternate Tape & Reel material with more robust pockets design to further reduce risk of bent leads during reel handling
Intended start of delivery: 2023-12-20 |
| 2024/08/22 |
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PCN(Product Change Notice)
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Description of change Old : Current Wire bonding material: - ASEKH (Taiwan) gold wire - ASEKH (Taiwan) copper palladium wire. - AMKOR ATP (Philippines) gold wire
New : Current Wire bonding material: - ASEKH (Taiwan) gold wire - ASEKH (Taiwan) copper palladium wire. - AMKOR ATP (Philippines) gold wire New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire
Timing / schedule Intended start of delivery 2024-11-01 |
| 2024/08/28 |
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PCN(Product Change Notice)
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Description Old: Current Wire bonding material: - ASEKH (Taiwan) gold wire - ASEKH (Taiwan) copper palladium wire. - AMKOR ATP (Philippines) gold wire New: Current Wire bonding material: - ASEKH (Taiwan) gold wire - ASEKH (Taiwan) copper palladium wire. - AMKOR ATP (Philippines) gold wire New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire
Timing / schedule Intended start of delivery 2024-11-01 |
| 2024/09/10 |
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PCN(Product Change Notice)
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Description of change Old Current assembly sites: - ASE Kaohsiung (Taiwan) Gold wire & Copper Palladium wire - AMKOR ATP (Philippine) Gold wire & Copper Palladium wire New Current assembly site: - ASE Kaohsiung (Taiwan) Gold wire & Copper Palladium wire - AMKOR ATP (Philippine) Gold wire & Copper Palladium wire Additional assembly site for extended capacity: - ST Muar (Malaysia) Copper Alloy wire
Timing / schedule Intended start of delivery 2024-12-16 |
| 2025/03/28 |
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PCN(Product Change Notice)
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Description of change Old: Bootloader V9.1 Known limitation Same data are output on the USART1_TX PB14 when using USART1 on PA10/PA9 Please refer to AN2606 Rev 65 - February 2025 New: New Boot loader version V9.2 is fixing the abnormal data output on the USART1_TX PB14 when using USART1 on PA10/PA9 Please refer to AN2606 Rev 66 - April 2025
Timing / schedule Intended start of delivery 2025-04-17 |
| 2025/07/03 |
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PCN(Product Change Notice)
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PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(2/3)
old/ Marking composition with no 2D marking
New/ New marking composition with 2D marking for production assembly |