PCN/PDN/NRND Information STM32H743VIT6｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND信息

PCN（产品/工艺变更通知）和PDN（生产中断通知）信息。

通知日期	通知类型	通知信息
2021/01/08	PCN（产品规格变更通知）	PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2022/04/24	PCN（产品规格变更通知）	Setup of a 2nd EMEA DC in Frankfurt for closer deliveries to customers in Germany & Eastern Europe. The change also includes personnel, location, logistic model..
2022/05/08	PCN（产品规格变更通知）	NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08
2022/05/08	PCN（产品规格变更通知）	Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08
2022/05/15	PCN（产品规格变更通知）	Notification related for 2nd EMEA DC project in Frankfurt
2022/07/06	PCN（产品规格变更通知）	STM32H74x & STM32H75x 2MB product BootLoader & secure firmware improvementt
2022/09/22	PCN（产品规格变更通知）	STM32H74x & STM32H75x 2MB product BootLoader & secure firmware improvement Timing / schedule Intended start of delivery : 2022-09-22
2023/05/16	PCN（产品规格变更通知）	ASE KaoHsiung (Taiwan) additional source - PCN10689 information alignment - Second level interconnect (e4) or Lead finishing material information actualized for AMKOR ATP (Philippines) for LQFP 100 14x14 package products
2023/09/13	PCN（产品规格变更通知）	ASE KaoHsiung (Taiwan) LQFP 100 14x14 package copper palladium bonding wire introduction on STM32H74x, STM32H75x, STM32G47x and STM32G48x Old Back-end source: - AMKOR ATP (Philippines) gold wire New Back-end source: - AMKOR ATP (Philippines) gold wire - ASE KaoHsiung (Taiwan) copper palladium wire - additional source Timing / schedule Intended start of delivery 2023-10-05
2024/08/22	PCN（产品规格变更通知）	Description of change Old : Current Wire bonding material: - ASEKH (Taiwan) gold wire - ASEKH (Taiwan) copper palladium wire. - AMKOR ATP (Philippines) gold wire New : Current Wire bonding material: - ASEKH (Taiwan) gold wire - ASEKH (Taiwan) copper palladium wire. - AMKOR ATP (Philippines) gold wire New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire Timing / schedule Intended start of delivery 2024-11-01
2024/08/28	PCN（产品规格变更通知）	Description Old: Current Wire bonding material: - ASEKH (Taiwan) gold wire - ASEKH (Taiwan) copper palladium wire. - AMKOR ATP (Philippines) gold wire New: Current Wire bonding material: - ASEKH (Taiwan) gold wire - ASEKH (Taiwan) copper palladium wire. - AMKOR ATP (Philippines) gold wire New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire Timing / schedule Intended start of delivery 2024-11-01
2024/09/10	PCN（产品规格变更通知）	Description of change Old Current assembly sites: - ASE Kaohsiung (Taiwan) Gold wire & Copper Palladium wire - AMKOR ATP (Philippine) Gold wire & Copper Palladium wire New Current assembly site: - ASE Kaohsiung (Taiwan) Gold wire & Copper Palladium wire - AMKOR ATP (Philippine) Gold wire & Copper Palladium wire Additional assembly site for extended capacity: - ST Muar (Malaysia) Copper Alloy wire Timing / schedule Intended start of delivery 2024-12-16
2025/03/28	PCN（产品规格变更通知）	Description of change Old: Bootloader V9.1 Known limitation Same data are output on the USART1_TX PB14 when using USART1 on PA10/PA9 Please refer to AN2606 Rev 65 - February 2025 New: New Boot loader version V9.2 is fixing the abnormal data output on the USART1_TX PB14 when using USART1 on PA10/PA9 Please refer to AN2606 Rev 66 - April 2025 Timing / schedule Intended start of delivery 2025-04-17
2025/07/03	PCN（产品规格变更通知）	PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(1/3) old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly
2025/07/18	PCN（产品规格变更通知）	PCN No. CRP/25/15294 Change Desc. Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter) Timing / schedule Intended start of delivery 2025-08-18
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Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
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