| 2023/05/12 |
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PCN(产品规格变更通知)
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Industrial grade Zener, Schottky and ESD Protection Diodes assembly in SMF (DO-219AB) Package convert to Clip bonding
Description of Change: The assembly technology of the affected part numbers will change from ”folded finger” to “soldered clip”.
Time Schedule: Start Shipment Date: Tue Jul 4, 2023 |
| 2024/06/19 |
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PCN(产品规格变更通知)
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Supplier Notice No.:PCN-DD-010-2024-REV-0 Title: Additional In-House Backend Assembly Site for Commercial Grade Zener, Schottky and ESD Products in SMF(DO-219AB) Package
Description of Change: Vishay Diodes Division is introducing an additional in-house back-end manufacturing site for Commercial Grade products in SMF package (Case Outline: DO-219AB).
Reason for Change: Capacity expansion and risk management
Expected Influence on Quality/Reliability/Performance: No change in quality and reliability performance.
Time Schedule: Start Shipment Date: Wed Jun 19, 2024 |
| 2024/11/26 |
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PCN(产品规格变更通知)
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Supplier Notice No.:PCN-DD-028-2024-REV-1 Title: Additional In-House Backend Assembly Site for ESD, Zener, TVS and Rectifier Products in SMF Package
Description of Change: Vishay Diodes Division is introducing an additional in-house manufacturing location for SMF (Case Outline: DO-219AB) in Tianjin, China. Among the affected part numbers, SL02 & SL03-GS08 & GS18 will be converted to “solder clip” assembly technology and also added to SMF production in Kaohsiung, Taiwan as they were not mentioned in previously released PCN-DD-011-2023 & PCN-DD-012-2023.
Reason for Change: Back up capacity for risk management
Start Shipment Date: Tue Nov 26, 2024
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