Mobile Phone teardown report:23013PC75G Fomalhaut Techno Solutions Mobile telephone teardown report - 商品詳細情報
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Mobile Phone teardown report:23013PC75G
Mobile Phone teardown report:23013PC75G
Mobile telephone teardown report
Mobile telephone teardown report
规格
- 制品名
- Mobile Phone teardown report:23013PC75G
- Model name
- 23013PC75G
- Manufacturer
- Xiaomi
- Release date
- 2023/05/09
- File size
- 7864KB
- Feature
- Snapdragon 8+ Gen 1と64MPメインカメラを搭載したゲーミングスマートフォン。
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C1S产品编号
:C1S228800009074
Stock -
| Pricing(USD) | |
|---|---|
| US$1,170 |
-
Product name : Mobile Phone teardown report:23013PC75G
Manufacturers : Fomalhaut Techno Solutions
数量 : 1
小计 : US$1,170.00
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Product name : Mobile Phone teardown report:23013PC75G
Manufacturers : Fomalhaut Techno Solutions
数量 : 1
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