| 2021/12/01 |
|
PCN(Product Change Notice)
|
a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site. |
| 2022/02/01 |
|
PCN(Product Change Notice)
|
Product Change Notification Date: 01-Feb-2022
CCB 4539 Cancellation Notice: For the qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site |
| 2022/02/28 |
|
PCN(Product Change Notice)
|
Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site. Estimated First Ship Date:February 28, 2022 |
| 2025/02/11 |
|
PCN(Product Change Notice)
|
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.
Pre Change : Microchip Technology Tempe ? Fab 2 (TMGR) Post Change : Microchip Technology Gresham ? Fab 4 (GRTM)
Estimated Qualification Completion Date: July 2025 |
| 2025/11/14 |
|
PCN(Product Change Notice)
|
PCN No.: ALAN-16SLVL366 Description: Final Notification : CCB 7364 Final Notice: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages. (cf. Interim Report : PP0000738356, PP0000738357, PP0000738358) |