| 2021/01/08 |
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PCN(Product Change Notice)
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PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2021/03/11 |
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PCN(Product Change Notice)
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AMKOR ATP (Philippines) enhanced Die Attach (new material) - All listed product in UFBGA package |
| 2021/06/15 |
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PCN(Product Change Notice)
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Old> marking composition with no SS marking New> marking composition with additional SS marking
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| 2022/05/08 |
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PCN(Product Change Notice)
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NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |
| 2022/09/22 |
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PCN(Product Change Notice)
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STM32H74x & STM32H75x 2MB product BootLoader & secure firmware improvement Timing / schedule Intended start of delivery : 2022-09-22 |
| 2023/10/31 |
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PCN(Product Change Notice)
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ASE Kaohsiung (Taiwan) additional source for STM32H74x/75x products in UFBGA 10x10 package
Timing / schedule Intended start of delivery 2024-01-10 |
| 2024/10/09 |
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PCN(Product Change Notice)
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Description of change Old : Current Wire bonding material: - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) gold and Copper Palladium wire. New : Current Wire bonding material: - AMKOR ATP (Philippines) gold wire - ASE Kaohsiung (Taiwan) gold and Copper Palladium wire. New Wire bonding material : - AMKOR ATP (Philippines) copper palladium wire
Timing / schedule Intended start of delivery 2024-12-16 |
| 2025/01/15 |
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PCN(Product Change Notice)
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Supplier Notice No.:PCI MDG/24/15095 Title: AMKOR ATP (Philippines) Enhanced traceability with 2D marking for UFBGA7x7 and UFBGA10x10 listed products ? (Addendum to PCN14374)
Description of change: Old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly
Anticipated Impact on form,fit,function, quality, reliability or processability? Form: Change is visible on marking area Fit : No change Function : No change Reliability : No change Processability : No change
Intended start of delivery: 2025-01-15 |
| 2025/03/28 |
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PCN(Product Change Notice)
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Description of change Old: Bootloader V9.1 Known limitation Same data are output on the USART1_TX PB14 when using USART1 on PA10/PA9 Please refer to AN2606 Rev 65 - February 2025 New: New Boot loader version V9.2 is fixing the abnormal data output on the USART1_TX PB14 when using USART1 on PA10/PA9 Please refer to AN2606 Rev 66 - April 2025
Timing / schedule Intended start of delivery 2025-04-17 |
| 2025/07/03 |
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PCN(Product Change Notice)
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PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(3/3)
old/ Marking composition with no 2D marking
New/ New marking composition with 2D marking for production assembly |
| 2025/12/15 |
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PCN(Product Change Notice)
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PCN No.:EMBEDDED PROCESSING/25/15272 Change Desc.:Chinese Supply Chain, as additional source, for STM32H75x/74x products in BGA packages.
Reason / motivation for change: Due to the success on the market of STM32 devices, ST Microcontrollers Division decided to qualify an additional front-end site to maintain state of the art service level to our customers thanks to extra capacity.
Intended start of delivery: 2025-12-15 |