| 2024/04/01 |
|
PCN(Product Change Notice)
|
Title:.
Notification of Addition of SOT-89-3/5 Mold Engraving
Description of change:
Additional character engraving inside the ejector pin circle in the center of the package surface
Reason:
To improve traceability and facilitate identification of defective parts.
Identification:
Lot No.
Effective date:
Scheduled for mass production from April 2024 |
| 2024/04/01 |
|
PCN(Product Change Notice)
|
Current factory: Nisshinbo Microdevice Co., Ltd. Kawagoe Office
Added factories: Nisshinbo Micro Devices Co., Ltd. Kawagoe Office and Nisshinbo Micro Devices Fukuoka Co., Ltd.
*Please note that there are no changes to the wafer test, assembly, and final test process factories. |
| 2024/07/31 |
|
PCN(Product Change Notice)
|
Supplier Notice No.: Sales Administration Department--2024--0009
Title:
SOT/SC Package Product: Change of Reel for Embossed Carrier Tape
Applicable Products:
The following PKG products are affected
SC-82AB
SOT-23-5
SOT-23-6
SOT-89-3
SOT-89-5
SC-88A
SOT-23-5-DC
SOT-23-6-1
SOT-89-3-2
SOT-89-5-1
SC-88A-DB
SOT-89-5-2
Products assembled by Nisshinbo Micro Devices (Thailand) Co.
Change details:
SOT/SC package products: Reel for embossed carrier tape will be changed.
Reel for embossed carrier tape will be changed.
Maker name and model number not disclosed.
Embossed carrier tape and cover tape will not be changed.
Reason:
To unify the materials used in our company.
Evaluation details and results
Both the current reel and the changed reel were evaluated and confirmed to be in compliance with the EIAJ standard.
We have confirmed that both reels are in compliance with the EIAJ standard.
Date of change: July 31, 2024
The change is scheduled to be applied from our production at the end of July 2024. |
| 2025/05/01 |
|
PCN(Product Change Notice)
|
Due to the discontinuation of production of the target resin by the mold resin manufacturer of this product,
the mold resin will be changed to ensure the continuous supply of this product.
Changes
Before change: Halogen-containing material
After change: Halogen-free material
Resin differences
・Mold resin: Different from the current version. In addition, it does not contain prohibited substances.
Target product Package: SOT-89-3, SOT-89-5
Schedule Mass production application: May 2025 (planned) |
