| 2021/01/08 |
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PCN(Product Change Notice)
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PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2022/03/31 |
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PCN(Product Change Notice)
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Wire Bond Method/Material Change Description of change Old: ASE Kaohsiung back-end: - Gold wire bonding assembly line New: ASE Kaohsiung back-end :- Gold wire bonding assembly line - New Copper Palladium added assembly line Intended start of delivery 2022-03-31 |
| 2023/08/28 |
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PCN(Product Change Notice)
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ASE Kaohsiung (Taiwan) - qualification of a second source substrate supplier (SCC - Shennan Circuit Company) for BGA package, size from BGA5x5 to BGA18x18, for listed products
Old First source Supplier, either ASEMTL-SH or TCI or Kinsus or Nanya is used over the different impacted products. New First source remains either ASEMTL-SH or TCI or Kinsus or Nanya depending on the product. Second source supplier SCC for all impacted products.
Timing / schedule Intended start of delivery 2023-09-06 |
| 2025/07/03 |
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PCN(Product Change Notice)
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PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(3/3)
old/ Marking composition with no 2D marking
New/ New marking composition with 2D marking for production assembly |