| 2024/06/15 |
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PCN(Product Change Notice)
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Nexperia changes the finished goods label, this includes: - Readable text~orderable part number (OPN) on SPQ and PQ labels, (34P) - 2D matrix code on SPQ~label, embedded with packing unit identifier (PUID) data - Replace (31D) Redate~by (32D) Date1 for new re-date code definition - QR code on PQ label (for~internal use mainly) * Since there are many applicable products, this notification is divided and notified. Therefore, depending on your purchase history, notifications may be sent in multiple notifications, but the following notifications will all be the same. Our notification number: PP0000735569 / PP0000735597 |
| 2025/06/19 |
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PCN(Product Change Notice)
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Introduction of Cu-wire bonding process for TSOP5-6 (SOT753-457) packages at ATSN (Nexperia Semiconductors Assembly & Test Plant Seremban Malaysia) - Replace Au (gold) wire with Cu (copper) wire in bonding process - No assembly location change - No diffusion fab location change - No wafer fab process change No change in form, fit, function, quality, workability and reliability anticipated |