| 2021/02/09 |
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PCN(Product Change Notice)
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Manufacturing Change : a new lead frame design |
| 2021/12/01 |
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PCN(Product Change Notice)
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a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site. |
| 2022/02/01 |
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PCN(Product Change Notice)
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Product Change Notification Date: 01-Feb-2022
CCB 4539 Cancellation Notice: For the qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site |
| 2022/02/28 |
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PCN(Product Change Notice)
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Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site. Estimated First Ship Date:February 28, 2022 |
| 2022/03/30 |
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PCN(Product Change Notice)
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CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site. Estimated First Ship Date:March 30, 2022 |
| 2025/01/06 |
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PCN(Product Change Notice)
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Microchip has released a new Datasheet for the 24AA64/24FC64/24LC64 - 64-Kbit I2C Serial EEPROM of devices. Date Document Changes Effective: 06 Jan 2025 |
| 2025/02/07 |
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PCN(Product Change Notice)
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Qualification of of U08D as a new fabrication site for selected products of the 24AA32A, 24AA32AF, 24LC32A, 24LC32AF, 24AA64, 24AA64F, 24FC64, 24FC64F, 24LC64, 24LC64F, AT24C32D, AT24C32E, AT24C64D and AT24C64B device families.
Estimated Qualification Completion Date:March 2025
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| 2025/02/21 |
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PCN(Product Change Notice)
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Qualification of CuPdAu as a new wire material, QMI-519 and AMK-EP27 as a new die attach material and AMK-MC27 as a new mold compound for selected 24AA32Ax, 24AA64x, 24FC64x, 24LC32Ax, 24LC64x, AT24C32x, and AT24C64x device families available in 8L SOIC (3.90mm) package.
Estimated First Ship Date: 31 March 2025 (date code: 2514) |
| 2025/07/22 |
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PCN(Product Change Notice)
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PCN No.: CENO-16EGCZ399 Description: CCBs 7684, 7686, 7703, 7704, 6429.001 and 7042.001 Final Notice: Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites. *As there are many affected products, we will inform you the model numbers by divided notifications. This is the 4/9th notification. |