2022/03/23 |
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PCN(Product Change Notice)
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Product Change Notification for Littelfuse MOSFET DISCRETE, IGBT DISCRETE, Thyristor and Diodes in TO-247 package add new manufacturing location |
2022/03/23 |
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PCN(Product Change Notice)
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Product Change Notification for Littelfuse MOSFET DISCRETE, IGBT DISCRETE, Thyristor and Diodes in TO-247 package add new manufacturing location |
2023/02/01 |
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PCN(Product Change Notice)
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Labeling Change
DESCRIPTION OF CHANGE: Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. |
2024/08/15 |
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PCN(Product Change Notice)
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Supplier Notice No.:LFPCN-DMI-BTA-2024-00101 Title: Product Change Notification for Littelfuse Discrete MOSFETs & IGBTs
DESCRIPTION OF CHANGE: 1. Addition of in-house assembly line in Lipa as a new supplier and alternative source for TO-247-3L, TO-247HV, PLUS247, PLUS TO-247HV (PLUS247HV), ISO247 and ISOPLUS247 packages. This will further streamline and enhance our supply chain efficiencies.
Form, fit, function changes: Littelfuse does not anticipate any change in form/fit/function of the affected part numbers.
The change will be implemented by 15th August 2024 if there is no further concern and feedback. |
2024/08/15 |
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PCN(Product Change Notice)
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Supplier Notice No.:LFPCN-DMI-BTA-2024-001/01 Title: Product Change Notification for Littelfuse Discrete MOSFETs & IGBTs
DESCRIPTION OF CHANGE: 1. Addition of in-house assembly line in Lipa as a new supplier and alternative source for TO-247-3L, TO-247HV, PLUS247, PLUS TO-247HV (PLUS247HV), ISO247 and ISOPLUS247 packages. This will further streamline and enhance our supply chain efficiencies. 2. Change in device marking 3. Change in inner box and tube labels, and tube dimensions
Form, fit, function changes: No
The change will be implemented by 15th August 2024 if there is no further concern and feedback. |
2024/10/21 |
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PCN(Product Change Notice)
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The ENEC marking for some switch product series will be removed due to duplication with existing UL certification. |
2025/02/26 |
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PCN(Product Change Notice)
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We will be adding a new alternative epoxy molding compound (EMC) to the back-end manufacturing of some discrete MOSFETs, IGBTs, multi-chip, and bipolar products. #: LFPCN-DMI-BTA-2024-003/01 |
2025/02/26 |
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PCN(Product Change Notice)
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Supplier Notice No.:LFPCN-DMI-BTA-2024-00301 Title: Product Change Notification for Littelfuse MOSFET, IGBT, Multichip and Power Bipolar Discrete Devices
DESCRIPTION OF CHANGE: Addition of new alternative epoxy molding compound for discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP). The new alternative epoxy molding compound has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B.
Form, fit, function changes: Littelfuse does not anticipate any change in form/fit/function of the affected part numbers
Affected parts shipped from February 26, 2025, will only be with the new EMC.
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2025/02/26 |
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PCN(Product Change Notice)
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Supplier Noatice No.:LFPCN-DMI-BTA-2024-00302 Title: Littelfuse has qualified an alternative epoxy molding compound (EMC), free of dechlorane plus,(Discrete IGBTs)
DESCRIPTION OF CHANGE: Qualification of the new alternative EMC, free of dechlorane plus, for the affected discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP). The new alternative EMC has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B.
Form, fit, function changes: Littelfuse does not anticipate any change in form/fit/function of the affected part numbers.
Affected parts shipped from February 26, 2025, will only be with the new EMC, free of dechlorane plus. |