PCN/PDN/NRND Information IXYH40N120B3D1｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2023/02/01	PCN(Product Change Notice)	Labeling Change DESCRIPTION OF CHANGE: Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product.
2023/02/13	PCN(Product Change Notice)	Product Change Notification for Littelfuse MOSFET DISCRETE, IGBT DISCRETE over 650V in TO-247 package adding new manufacturing location We would like to notify you of the differences between the existing manufacture and the new manufacture. 1. POD – Package Outline Dimension 2. Package Marking 3. BOM 4. Label
2023/02/13	PCN(Product Change Notice)	Littelfuse would like to notify you of a change related to the TO-247 package for over 650V. DESCRIPTION OF CHANGE: As a part of Littelfuse endeavors to improve the manufacturing footprint and to enhance capacity, it has been decided to introduce a new TO-247 backend manufacturing in China.
2023/02/14	PCN(Product Change Notice)	MOSFET DISCRETE, IGBT DISCRETE over 650V in TO-247 package adding new manufacturing location As a part of Littelfuse endeavors to improve the manufacturing footprint and to enhance capacity, it has been decided to introduce a new TO-247 backend manufacturing ATXWH in China.
2024/10/21	PCN(Product Change Notice)	The ENEC marking for some switch product series will be removed due to duplication with existing UL certification.
2025/02/26	PCN(Product Change Notice)	We will be adding a new alternative epoxy molding compound (EMC) to the back-end manufacturing of some discrete MOSFETs, IGBTs, multi-chip, and bipolar products. #: LFPCN-DMI-BTA-2024-003/01
2025/02/26	PCN(Product Change Notice)	Supplier Notice No.:LFPCN-DMI-BTA-2024-00301 Title: Product Change Notification for Littelfuse MOSFET, IGBT, Multichip and Power Bipolar Discrete Devices DESCRIPTION OF CHANGE: Addition of new alternative epoxy molding compound for discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP). The new alternative epoxy molding compound has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B. Form, fit, function changes: Littelfuse does not anticipate any change in form/fit/function of the affected part numbers Affected parts shipped from February 26, 2025, will only be with the new EMC.
2025/02/26	PCN(Product Change Notice)	Supplier Noatice No.:LFPCN-DMI-BTA-2024-00302 Title: Littelfuse has qualified an alternative epoxy molding compound (EMC), free of dechlorane plus,(Discrete IGBTs) DESCRIPTION OF CHANGE: Qualification of the new alternative EMC, free of dechlorane plus, for the affected discrete MOSFET, IGBT, multichip and bipolar parts shall allow Littelfuse to effectively serve business continuity plan (BCP). The new alternative EMC has been qualified for the following packages: TO-262, TO-263, TO-263HV, TO-220, TO-3P, ISO247, TO-247, PLUS247, TO-268, TO-268HV, TO-264, PLUS264 and SOT-227B. Form, fit, function changes: Littelfuse does not anticipate any change in form/fit/function of the affected part numbers. Affected parts shipped from February 26, 2025, will only be with the new EMC, free of dechlorane plus.
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PCN/PDN/NRND Information

Notification Type

Notification Information

Notification Date

Products subject to notification

Manufacturer	Manufacturer Part Number	Last Time Buy	Successor Products

Product & Sales Information of products subject to notification

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Inventory Information ▼

: JP:Japan, HK:Hong Kong, US:United States
EU:Europe, AUS:Australia, Asia:Asia, NA:North America

Supplier Information ▼

: Sourced from manufacturers and authorized distributors

: Stocks of semiconductor sourced from authorized distributors

Product Information ▼

MOQ/SPQ

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SPQ：: Number of units that can be ordered.
Please enter a quantity in multiples of the SPQ when ordering.

Reel Processing
It is a service that connects empty tape to both ends of a tape cut using a special tool, set the reel, and rewind it into the packaged form for delivery. It is made so that it can be set as is to a mounting machine. Processing is available from 100 pieces or more.
PCN/PDN Information
Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
For details regarding product specification changes or discontinuation, please ensure to check the manufacturer's official website.

Package type▼: Bulk:
Bulk is a package which the separete parts are packed in a bag, or packed individually.
Tape & Reel:
Tape & Reel is the unmodified original reel received from the manufacturer.
In case the MOQ is smaller than the manufacturer's standard package quantity, it will be cut tapes even if the package is shown as "Tape & Reel".
Cut tape:
Cut tape is a tape cut from an original reel. Cut tape does not contain a leader or trailer.
If you require a one continuous cut tape, please put your comment on your remarks.
For our supplier's stock, we are unable to ensure that the package will be one continuous cut tape even if you put your remark.

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Product Information ▼

: New Products released by manufacturers within 1 year

: New Products on Chip One Stop website within 3 months

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PCN/PDN/NRND Information

Product & Sales Information of products subject to notification