| 2021/02/24 |
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PCN(Product Change Notice)
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Notice regarding improper UL certification of molded resin (encapsulant) delivered to us We are in the process of confirming with UL LLC whether the safety certification can be maintained for our products that use the subject encapsulant and for which UL safety certification has been obtained. We are currently confirming with UL LLC whether the safety certification can be maintained for our products that have obtained UL safety certification. As for the flame retardancy of the subject encapsulant, Kyocera's in-house tests (based on IEC 60695-11-10) have shown that the material is not flammable. |
| 2021/07/01 |
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PCN(Product Change Notice)
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Renesas plans to add the site of Wafer test for RZ/T1 and EC-1 to realize stable supply. Ardentec Corp. (HsinChu, Taiwan) Renesas would like to deliver products produced in the added site for your orders. |
| 2023/01/01 |
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PCN(Product Change Notice)
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Notice of Change in Substrate Materials for TFLGA, LFBGA, and TFBGA Products Effective Date: 1/1/2023 |
| 2023/01/01 |
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PCN(Product Change Notice)
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Notice of Change in Substrate Materials for TFLGA, LFBGA, and TFBGA Products Effective Date: 1/1/2023 |
| 2023/01/31 |
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PCN(Product Change Notice)
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The substrate materials (core material and through hole plugging material) will be changed. Schedules: Change Implementation: e/o Jan. 2023 onwards |
| 2023/03/01 |
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PCN(Product Change Notice)
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Site addition of package assembly and final test Effective Date: 3/1/2023 Renesas plans to add the site of assembly/final test for RZ/T1 320BGA to realize stable supply. |