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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2020/09/02 PCN(Product Change Notice) ASE Kaohsiung (Taiwan) additional source and Product enhancement for STM32MP15x in
LFBGA18X18 package source
2021/01/08 PCN(Product Change Notice) PRODUCT / PROCESS CHANGE INFORMATION
MBB (Material Barrier Bag) : extend print out warning message on shelf life
Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation…
(OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags.
(NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags.
2022/05/08 PCN(Product Change Notice) NEW DISTRIBUTION CENTER
Notification related to 2nd EMEA DC project in Frankfurt
Timing / schedule
Intended start of delivery 2022-05-08
2023/04/05 PCN(Product Change Notice) AMKOR (Korea) - qualification of a second source substrate supplier
(SCC - Shennan Circuit Company) for BGA18x18, BGA16x16, BGA12x12 and BGA10x10 for STM32MP15x products

Timing / schedule Intended start of delivery 2023-03-27
2023/08/28 PCN(Product Change Notice) ASE Kaohsiung (Taiwan)
- qualification of a second source substrate supplier (SCC - Shennan Circuit Company)
for BGA package, size from BGA5x5 to BGA18x18, for listed products

Old
First source Supplier, either ASEMTL-SH or TCI or Kinsus or Nanya is used over the different
impacted products.
New
First source remains either ASEMTL-SH or TCI or Kinsus or Nanya depending on the product.
Second source supplier SCC for all impacted products.

Timing / schedule Intended start of delivery 2023-09-06
2023/12/07 PCN(Product Change Notice) Supplier Notice No.:MDG/24/13550
Title:
STM32MP151x STM32MP153x STM32MP157x - Security Advisory - Improper isolation of protected secure resources.

Description:
Old:
STM32MP157x (Die 500 -revision B, Z) product has Improper isolation of protected secure resource
New:
STM32MP151x STM32MP153x STM32MP157x products vulnerability for secure and non-secure embedded software can be worked around by following the remediation as described in the ST Technical Note TN1500 ""Security advisory TN1500-STPSIRT:Improper isolation of protected secure resource""

Anticipated Impact on form,fit, function, quality, reliability or processability?
No impact

Intended start of delivery:
2023-12-07
2024/02/20 PCN(Product Change Notice) Description of change
Old: Existing Back-end source:
- Amkor ATK Korea
- ASE Kaohsiung Taiwan
New: Back-end sources:
- Amkor ATK Korea
- ASE Kaohsiung Taiwan
- ST Calamba Philippines - Additional source
For detailed information, please refer to PCN14291
? Additional information attached document.
2025/07/03 PCN(Product Change Notice) PCN No.:MICROCONTROLLERS/25/15246
Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed
products(1/3)

old/
Marking composition with no 2D marking

New/
New marking composition with 2D marking for
production assembly
2025/07/18 PCN(Product Change Notice) PCN No. CRP/25/15294
Change Desc.
Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)

Timing / schedule Intended start of delivery 2025-08-18
2026/02/17 PCN(Product Change Notice) PDN No.: EMBEDDED PROCESSING/25/15833
Description: STM32MP15x - product enhancement : Die redesign : Mask or mask set change with new die design like metallization (specifically chip frontside) or bug fix
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PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
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