| 2021/01/08 |
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PCN(Product Change Notice)
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PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2022/04/24 |
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PCN(Product Change Notice)
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Setup of a 2nd EMEA DC in Frankfurt for closer deliveries to customers in Germany & Eastern Europe. The change also includes personnel, location, logistic model.. |
| 2022/05/08 |
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PCN(Product Change Notice)
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NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |
| 2022/05/15 |
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PCN(Product Change Notice)
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Notification related for 2nd EMEA DC project in Frankfurt |
| 2022/11/23 |
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PCN(Product Change Notice)
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ST MUAR Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10 & LQFP14x14 Timing / schedule Intended start of delivery 2022-11-23 |
| 2023/05/15 |
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PCN(Product Change Notice)
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ASE KaoHsiung (Taiwan) LQFP7x7, LQFP10x10, LQFP14x14 and LQFP20x20 package copper palladium bonding wire introduction on STM32F2/F4/F7x, STM32G0/G4x, STM32L4/L5x and STM32H5/H7x listed products
Timing / schedule Intended start of delivery 2023-05-15 |
| 2023/05/16 |
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PCN(Product Change Notice)
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ASE KaoHsiung (Taiwan) additional source - PCN10689 information alignment - Second level interconnect (e4) or Lead finishing material information actualized for AMKOR ATP (Philippines) for LQFP 100 14x14 package products |
| 2023/06/20 |
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PCN(Product Change Notice)
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AMKOR ATP (Philippines) LQFP100 14x14 and LQFP144 20x20 Copper wire introduction and standardization to post plated leadframes on listed products
Old: gold wire bonding Pre-plated leadframes (PPF) New: copper palladium wire bonding post plated leadframe (DR) |
| 2023/12/20 |
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PCN(Product Change Notice)
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Supplier Notice No.:MDG/23/14387 Title: AMKOR ATP (Philippines) - UBoT Carrier Tape & Cover Tape alternative packing material for TQFP14x14x1.4 package listed products.
Description of change: Old:KOSTAT carrier tape and cover tape. New:KOSTAT carrier tape and cover tape (until depletion of current material). Then UBoT carrier tape and cover tape.
Anticipated Impact on form,fit, function, quality, reliability or processability? no impact
Motivation: Alternate Tape & Reel material with more robust pockets design to further reduce risk of bent leads during reel handling
Intended start of delivery: 2023-12-20 |
| 2023/12/20 |
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PCN(Product Change Notice)
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Supplier Notice No.:MDG/23/14387 Title: AMKOR ATP (Philippines) - UBoT Carrier Tape & Cover Tape alternative packing material for TQFP14x14x1.4 package listed products.
Description of change: Old:KOSTAT carrier tape and cover tape. New:KOSTAT carrier tape and cover tape (until depletion of current material). Then UBoT carrier tape and cover tape.
Anticipated Impact on form,fit, function, quality, reliability or processability? no impact
Motivation: Alternate Tape & Reel material with more robust pockets design to further reduce risk of bent leads during reel handling
Intended start of delivery: 2023-12-20 |
| 2025/07/03 |
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PCN(Product Change Notice)
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PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(1/3)
old/ Marking composition with no 2D marking
New/ New marking composition with 2D marking for production assembly |
| 2025/07/18 |
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PCN(Product Change Notice)
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PCN No. CRP/25/15294 Change Desc. Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)
Timing / schedule Intended start of delivery 2025-08-18 |