| 2023/03/21 |
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PCN(Product Change Notice)
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Qualification of G700HFC mold compound for Non-Auto Rectifier DPAK package Mold compound Before : CEL8240HF10NF-2 After : G700HFC
Proposed First Ship date: 21 Mar 2023 |
| 2023/03/21 |
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PCN(Product Change Notice)
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DPAK case outline 369C - Assembly and Test Qualification to JCET Semiconductor (Suqian) Co.Ltd., China for Capacity Expansion |
| 2023/03/21 |
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PCN(Product Change Notice)
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Description and Purpose: In the original FPCN23681X, 8 mils wire size & EMC change for Ultrafast devices was erroneously mentioned in the description and purpose. This update notification is being issued to clarify and correct the changes below: From : This is the Final Product Change Notification to announce the qualification of to 8 mils wire size and G700HFC mold compound on selected Rectifier Ultrafast devices in DPAK package. This change is to improve quality robustness. To: This is the Final Product Change Notification to announce the qualification of G700HFC mold compound on selected Rectifier devices in DPAK package. This change is to improve quality robustness.
Once the expiration of the FPCN, all products listed here will be changed with new Bill of Material.
Proposed First Ship date: 21 Mar 2023 |
| 2023/04/30 |
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PCN(Product Change Notice)
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DPAK case outline 369C - Assembly and Test Qualification to JCET Semiconductor (Suqian) Co.Ltd., China for Capacity Expansion Proposed First Ship date: 30 Apr 2023 |