| 2022/05/08 |
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PCN(Product Change Notice)
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NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |
| 2023/06/20 |
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PCN(Product Change Notice)
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AMKOR ATP (Philippines) LQFP100 14x14 and LQFP144 20x20 Copper wire introduction and standardization to post plated leadframes on listed products
Old: gold wire bonding Pre-plated leadframes (PPF) New: copper palladium wire bonding post plated leadframe (DR) |
| 2025/05/20 |
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PCN(Product Change Notice)
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ASE KaoHsiung (Taiwan) additional source for legacy STM32F2x, STM32F4x and STM32F7x Description of change
Old Current assembly sites (depending on package/product): - ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice, - AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice, - AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice, - ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice, - ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice, - JSCC (China) Gold for Crolles, TSMC & Rousset Dice, - JSCC (China) Copper Palladium wire for Crolles, TSMC Dice. You may refer to 15271_Additional information.pdf document for further details.
New Current assembly sites: (depending on package/product): - ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice, - AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice, - AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice, - ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice, - ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice, - JSCC (China) Gold for Crolles, TSMC & Rousset Dice, - JSCC (China) Copper Palladium wire for Crolles, TSMC Dice. Additional assembly site for extended capacity: - ASE Kaohsiung (Taiwan) Copper Palladium wire for Rousset Dice.
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| 2025/07/03 |
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PCN(Product Change Notice)
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PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(3/3)
old/ Marking composition with no 2D marking
New/ New marking composition with 2D marking for production assembly |
| 2025/08/12 |
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PCN(Product Change Notice)
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Supplier Notice No.:MICROCONTROLLERS/25/15304 Title:ST ROUSSET (France) additional source for STM32F75x/74x listed products in M10/90nm technology.
Description: Old/ Front-end sources for Die 449 cut1.1 : - ST Crolles (France) CR300 revision Z - TSMC (Taiwan) FAB14 revision 1
New/ Front-end sources for Die 449 cut1.1 : - ST Crolles (France) CR300 revision Z - TSMC (Taiwan) FAB14 revision 1 Additional source - ST Rousset (France) RS8F revision 2
Anticipated Impact on form,fit,function, quality, reliability or processability? No change on Form, Fit or Function - same datasheet.
Intended start of delivery: 2025-08-12 |
| 2025/08/12 |
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PCN(Product Change Notice)
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PCN No.:EMBEDDED PROCESSING/25/15304 Change Desc.:ST ROUSSET (France) additional source for STM32F75x/74x listed products in M10/90nm technology.
Intended start of delivery: 2025-08-12 |