| 2025/04/30 |
|
PCN(Product Change Notice)
|
Description of change Old : Bonding wire: 1.3mil Gold wire (Au) New : Bonding wire: 1.2mil Copper wire (Cu)
Timing / schedule Intended start of delivery 2025-07-25 |
| 2025/08/18 |
|
PCN(Product Change Notice)
|
PCN No. CRP/25/15292 Change Desc. Additional 2D in ST Standard Inner Bulk Label (APMS perimeter)
Timing / schedule Intended start of delivery 2025-08-18 |
| 2026/05/29 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:CRP/25/15383 Title:(1/4)ST manufacturing reshaping program - Corporate PCI - Early Notification
Description of change: Old/ST manufacturing landscape New/Reshaping of ST’s manufacturing footprint by end 2027
Anticipated Impact on form,fit,function, quality, reliability or processability? Form : no impact Fit : no impact Function : no impact Reliability : no impact Processability : no impact
Intended start of delivery: 2026-05-29 |
| 2026/05/29 |
|
PCN(Product Change Notice)
|
Supplier Notice No.:CRP/25/15383 Title:(1/4)ST manufacturing reshaping program - Corporate PCI - Early Notification
Description of change: Old/ST manufacturing landscape New/Reshaping of ST’s manufacturing footprint by end 2027
Anticipated Impact on form,fit,function, quality, reliability or processability? Form : no impact Fit : no impact Function : no impact Reliability : no impact Processability : no impact
Intended start of delivery: 2026-05-29 |
| 2027/03/31 |
|
PCN(Product Change Notice)
|
PDN No.: ANALOG MEMS SENSORS/25/15578 Description: ST Manufacturing Reshaping (Analog_BCD6_AG200toSG8_All): Qualification of SG8 (Singapore) as new FE Location. |