| 2021/12/05 |
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PCN(Product Change Notice)
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Laser Mark Conversion for 12-Lead MSOP Packages Assembled in ADPG and UTAC Revision Description: Adding additional parts. Effectivity Date: 03-Sep-2021 |
| 2024/06/05 |
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PCN(Product Change Notice)
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Epoxy formulation changefrom Henkel 8290 to Henkel 8290A. 8290A is a more robust epoxy with minimal outgassing due to its less volatile fluorocarbon content. |
| 2024/08/24 |
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PCN(Product Change Notice)
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ADI is transferring LTC3639 product currently manufactured using the 0.6μm BICMOS process from wafer fab facility located at Camas, Washington to Vanguard International Semiconductor, Taiwan. |
| 2024/08/24 |
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PCN(Product Change Notice)
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Supplier Notice No.;PCN 24_0067 Rev. - Title: Notification of Wafer Fab Location Change for 0.6μm BICMOS Process Devices from ADCS to Vanguard Int. (Taiwan)
Description Of Change: ADI is transferring LTC3639 product currently manufactured using the 0.6μm BICMOS process from wafer fab facility located at Camas,Washington to Vanguard International Semiconductor, Taiwan.
Reason For Change: Vanguard has been a successful wafer fab foundry partner for ADI, and this business expansion will ensure continuity of supply to our customers well into the future.
Impact of the change (positive or negative) on fit, form, function & reliability: The qualification of 0.6μm BICMOS process from the Vanguard International Semiconductor has been completed following AEC-Q100 qualification requirements.The devices will be characterized over the full operating temperature range.
Effectivity Date: 24-Aug-2024 (the earliest date that a customer could expect to receive changed material) |