| 2023/09/13 |
|
PCN(Product Change Notice)
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ASE KaoHsiung (Taiwan) LQFP 100 14x14 package copper palladium bonding wire introduction on STM32H74x, STM32H75x, STM32G47x and STM32G48x
Old Back-end source: - AMKOR ATP (Philippines) gold wire New Back-end source: - AMKOR ATP (Philippines) gold wire - ASE KaoHsiung (Taiwan) copper palladium wire - additional source
Timing / schedule Intended start of delivery 2023-10-05 |
| 2024/09/10 |
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PCN(Product Change Notice)
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Description of change Old Current assembly sites: - ASE Kaohsiung (Taiwan) Gold wire & Copper Palladium wire - AMKOR ATP (Philippine) Gold wire & Copper Palladium wire New Current assembly site: - ASE Kaohsiung (Taiwan) Gold wire & Copper Palladium wire - AMKOR ATP (Philippine) Gold wire & Copper Palladium wire Additional assembly site for extended capacity: - ST Muar (Malaysia) Copper Alloy wire
Timing / schedule Intended start of delivery 2024-12-16 |
| 2025/02/28 |
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PCN(Product Change Notice)
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ST Crolles (France) additional source for STM32G41x/G47x/G48x, STM32L43x/L44x/L4Zx and STM32L47x/L48x products in M10/90nm technology. |
| 2025/07/03 |
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PCN(Product Change Notice)
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PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(3/3)
old/ Marking composition with no 2D marking
New/ New marking composition with 2D marking for production assembly |