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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2022/12/20 PCN(Product Change Notice) Product enhancement
Die redesign : Mask or mask set change with new die design like metallization (specifically chip frontside) or bug fix
Timing / schedule Intended start of delivery 2022-12-20
2023/05/15 PCN(Product Change Notice) ASE KaoHsiung (Taiwan) LQFP7x7, LQFP10x10, LQFP14x14 and LQFP20x20 package
copper palladium bonding wire introduction on STM32F2/F4/F7x, STM32G0/G4x, STM32L4/L5x
and STM32H5/H7x listed products

Timing / schedule Intended start of delivery 2023-05-15
2024/04/15 PCN(Product Change Notice) Description of change
Old Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire
New Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire
Added Wire bonding material :
- JSCC (China) Copper Palladium wire

Timing / schedule Intended start of delivery 2024-06-30
2024/06/30 PCN(Product Change Notice) Supplier Notice No.:MDG/24/14363
Title:
JJSCC (China) LQFP7x7 32L/48L , LQFP10x10 64L and LQFP12x12 80L package copper palladium bonding wire introduction on STM32C0x, STM32G0/G4x, STM32H5/H7x, STM32L4/L5x and STM32U5x listed products

Description of change:
Old Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire

New Current Wire bonding material:
- JSCC (China) Gold wire or Silver wire
- ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire

Added Wire bonding material :
- JSCC (China) Copper Palladium wire

Anticipated Impact on form,fit,function, quality, reliability orprocessability?
no impact on form, Fit, Function

Intended start of delivery:
2024-06-30
2024/07/23 PCN(Product Change Notice) Old: Front-end sources for die 460 cut2.1 / die 467 cut 1.1
- TSMC (Taiwan) FAB14
New: Front-end sources for die 460 cut2.1 / die 467 Cut 1.1
- TSMC (Taiwan) FAB14
- Crolles 300 ( France) additional source

Timing / schedule Intended start of delivery 2024-09-13
2024/09/02 PCN(Product Change Notice) Supplier Notice No.:24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products

Description of change:
Old/Marking composition with no 2D marking
New/New marking composition with 2D marking for production assembly

Motivation:
to enhance traceability

Intended start of delivery:
2024-09-02
2024/12/04 PCN(Product Change Notice) Supplier Notice No.:MICROCONTROLLERS/24/15033
Title:
JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products

Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly

Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change

Intended start of delivery:
2024-12-04

Intended start of delivery 2024-12-04
2024/12/04 PCN(Product Change Notice) JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products
2025/04/15 PCN(Product Change Notice) Supplier Notice No.:MICROCONTROLLERS/25/15166
Title:
JSCC (China) - KOSTAT Carrier Tape & Cover Tape alternative packing material for TQFP7x7 & QFP10x10 package on listed products.

Description of change:
Old/
For QFP7X7, QFP10X10 packages
- E-PAK carrier tape and cover tape

New/
For QFP7X7 & QFP10X10 packages
- E-PAK carrier tape and cover tape (until depletion of current material).
- Then KOSTAT carrier tape (4-side partial fence) and cover tape.

Intended start of delivery:
2025-04-15
2025/04/15 PCN(Product Change Notice) Description of change
Old : Refer to application Note AN2606 Revision 65 - February 2025 :
STM32G071/81xx listed devices having the
Bootloader version 11.3
- Empty check Flag is cleared by error on the boot sequence
- I2C connection stretching the line for a long time which
is not supported by some HW hosts

New : Refer to application Note AN2606 Revision 66 - April 2025/
STM32G071/81xx devices will have the new
Bootloader version 11.4 :
- A global peripherals de-init was added on the
BL boot sequence to fix issues generating deinitialization
of all resources needed by the BL
SW so clearing the empty check flag.
- I2C connection stretching the line for a long
time which is not supported by some HW hosts is fixed

Timing / schedule Intended start of delivery 2025-04-15
2025/07/18 PCN(Product Change Notice) PCN No. CRP/25/15294
Change Desc.
Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)

Timing / schedule Intended start of delivery 2025-08-18
2025/09/02 PCN(Product Change Notice) ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products
2025/09/02 PCN(Product Change Notice) Supplier Notice No.:MDG/24/14718
Title:
ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14,LQFP20x20 & LQFP24x24 listed products

Description of change:
Old/
Marking composition with no 2D marking
New/
New marking composition with 2D marking for production assembly

Motivation:
to enhance traceability

Anticipated Impact on form,fit,function, quality, reliability or processability?
Form: Change is visible on marking area
Fit : No change
Function : No change
Reliability : No change
Processability : No change

Intended start of delivery:
2025-09-02
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PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
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