PCN/PDN/NRND Information BAT54S-7-F｜Chip One Stop - Mail order site for electronic parts and semiconductors

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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date	Notification Type	Notification Information
2020/08/25	PCN(Product Change Notice)	PRODUCT CHANGE NOTIFICATION SUMMARY
2020/09/15	PCN(Product Change Notice)	PRODUCT CHANGE NOTIFICATION
2020/10/01	PCN(Product Change Notice)	Change Type: Assembly & Test Site Change / Part Top Marking Rev 2: Added Table 4 below identifying package outline dimension changes for SOT-23, SOT-323 and SOT-363 packages
2020/11/20	PCN(Product Change Notice)	PRODUCT CHANGE NOTIFICATION REV 2: This interim update provides a partial listing of affected part numbers for which qualification is complete for the changes listed in the title of the tables below. Qualification / reliability reports are attached (embedded in this file). For other associated changes (identified in the Advance version (Rev 1) of PCN-2461 released May 8th, 2020) qualification testing is ongoing. Updates and qualification data will be provided in the Final version of this PCN. The Final version of this PCN is expected to be issued by January 31st, 2021, once all qualification has been completed.
2020/12/04	PCN(Product Change Notice)	PRODUCT CHANGE NOTIFICATION REV 2: This interim update provids a partial listing of affected part numbers for which qualification is complete for the changes listed in the title of the tables below. An additional Diodes internal assembly and test site (SAT) in Shanghai, China is also being added for products listed in table 4 below. Qualification / reliability reports are attached (embedded in this file). For other associated changes (identified in the Advance version (Rev 1) of PCN-2477 released August 17th, 2020) qualification testing is ongoing. Updates and qualification data will be provided in the Final version of this PCN. The final PCN is expected to be issued by January 31st, 2021 once all qualification has been completed.
2021/03/09	PCN(Product Change Notice)	2477 REV 3 ? FINAL UPDATE : Additional Wafer Source (GFAB), Additional Assembly/Test (A/T) Site (SAT), and Transfer Assembly/Test Site to DIYI
2021/04/05	PCN(Product Change Notice)	REV 3: This update provides the final listing of affected part numbers for which qualification is complete for the changes
2022/04/04	PCN(Product Change Notice)	Fabrication Site Change Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products Implementation Date: 4 April, 2022
2024/06/03	PCN(Product Change Notice)	Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products.
2024/08/29	PCN(Product Change Notice)	Supplier Notice No.:PCN-2690 REV 1 Title: Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products. DESCRIPTION OF CHANGE: This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified its subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as additional Assembly and Test site using PdCu wire with plating at Bandl for discrete products listed in the table below. IMPACT: Continuity of Supply. No change in datasheet electrical parameters and product performance. Implementation Date: 29 August, 2024
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PCN/PDN/NRND Information

Notification Type

Notification Information

Notification Date

Products subject to notification

Manufacturer	Manufacturer Part Number	Last Time Buy	Successor Products

Product & Sales Information of products subject to notification

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Inventory Information ▼

: JP:Japan, HK:Hong Kong, US:United States
EU:Europe, AUS:Australia, Asia:Asia, NA:North America

Supplier Information ▼

: Sourced from manufacturers and authorized distributors

: Stocks of semiconductor sourced from authorized distributors

Product Information ▼

MOQ/SPQ

MOQ：: Minimum purchase quantity that can be ordered.
Please enter a number greater than the MOQ when ordering.

SPQ：: Number of units that can be ordered.
Please enter a quantity in multiples of the SPQ when ordering.

Reel Processing
It is a service that connects empty tape to both ends of a tape cut using a special tool, set the reel, and rewind it into the packaged form for delivery. It is made so that it can be set as is to a mounting machine. Processing is available from 100 pieces or more.
PCN/PDN Information
Information displayed when specification changes in PCN information (Product Change Notification) or PDN information (Product Discontinuance information) available.
For details regarding product specification changes or discontinuation, please ensure to check the manufacturer's official website.

Package type▼: Bulk:
Bulk is a package which the separete parts are packed in a bag, or packed individually.
Tape & Reel:
Tape & Reel is the unmodified original reel received from the manufacturer.
In case the MOQ is smaller than the manufacturer's standard package quantity, it will be cut tapes even if the package is shown as "Tape & Reel".
Cut tape:
Cut tape is a tape cut from an original reel. Cut tape does not contain a leader or trailer.
If you require a one continuous cut tape, please put your comment on your remarks.
For our supplier's stock, we are unable to ensure that the package will be one continuous cut tape even if you put your remark.

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Product Information ▼

: New Products released by manufacturers within 1 year

: New Products on Chip One Stop website within 3 months

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PCN/PDN/NRND Information

Product & Sales Information of products subject to notification