| 2020/09/08 |
|
PCN(Product Change Notice)
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PRODUCT CHANGE NOTIFICATION |
| 2020/09/09 |
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PCN(Product Change Notice)
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PRODUCT CHANGE NOTIFICATION |
| 2020/10/01 |
|
PCN(Product Change Notice)
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MCU/SOC (GP products) announcement of Full carton |
| 2021/04/01 |
|
PCN(Product Change Notice)
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RE-PROCESSED to include LTB Date to 4/01/2021 for packing change from Fractional Tray to Full Carton : Shipments from REA of devices in Full Cartons begins. October 1, 2020 |
| 2021/04/01 |
|
PCN(Product Change Notice)
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RE-PROCESSED to include LTB Date to 4/01/2021 for packing form with a tray from fraction to Full Carton (full packing) : Full Carton shipment will become standard, combining max. 3 lot codes worst case |
| 2023/02/14 |
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PDN(Product Discontinuation Notice)
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Notice of post-process site, material change and model name change for 176pin-LQFP products of RA(RA6M3)/SYNERGY(S5D9) |
| 2023/02/17 |
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PDN(Product Discontinuation Notice)
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Change ordering model name Change of back-end factories (assembly & test) Change of assembly materials Change Implementation: Jul. 2023 onwards |
| 2025/03/01 |
|
PCN(Product Change Notice)
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Supplier Notice No.: Title: Notice of Change of Die-Bond Material for RA, SYNERGY and RX Surface-Mount Package Productsa
Description of Change: The back-end factory: Renesas Semiconductor (Suzhou) Co., Ltd (“Suzhou”). Changes: The die-bond material will be changed. The new die-bond material is a proven one for mass production at “Suzhou”.
Reason for Change: To change to an alternate material due to the termination of supply of the material by the die-bond materials manufacturer.
Impact on Fit, Form, Function, Quality & Reliability: This change will not affect fitting, form, function, quality, and reliability.
Effective Date: 3/1/2025 |
| 2025/03/01 |
|
PCN(Product Change Notice)
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NOTICE OF CHANGE OF DIE-BOND MATERIAL FOR RA, SYNERGY AND RX SURFACE-MOUNT PACKAGE PRODUCTS |