| 2021/01/08 |
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PCN(Product Change Notice)
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PRODUCT / PROCESS CHANGE INFORMATION MBB (Material Barrier Bag) : extend print out warning message on shelf life Type of change: Any indirect material modifications for shipping products in dimensions, material, composition, orientation… (OLD) Due to historical reasons, the MBB ST is providing for SMD (Surface Mount Device) products have printed advise message alerting on 12 months of shelf life in sealed bags. (NEW) To align with extended shelf life International trends, the print out advise message for SMD products and in any case all products packed with MBB will be changed alerting on 24 months of shelf life in sealed bags. |
| 2022/05/08 |
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PCN(Product Change Notice)
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NEW DISTRIBUTION CENTER Notification related to 2nd EMEA DC project in Frankfurt Timing / schedule Intended start of delivery 2022-05-08 |
| 2023/06/20 |
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PCN(Product Change Notice)
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AMKOR ATP (Philippines) LQFP100 14x14 and LQFP144 20x20 Copper wire introduction and standardization to post plated leadframes on listed products
Old: gold wire bonding Pre-plated leadframes (PPF) New: copper palladium wire bonding post plated leadframe (DR) |
| 2025/05/20 |
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PCN(Product Change Notice)
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ASE KaoHsiung (Taiwan) additional source for legacy STM32F2x, STM32F4x and STM32F7x Description of change
Old Current assembly sites (depending on package/product): - ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice, - AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice, - AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice, - ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice, - ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice, - JSCC (China) Gold for Crolles, TSMC & Rousset Dice, - JSCC (China) Copper Palladium wire for Crolles, TSMC Dice. You may refer to 15271_Additional information.pdf document for further details.
New Current assembly sites: (depending on package/product): - ST Muar (Malaysia) Silver wire for Crolles & TSMC Dice, - AMKOR ATP (Philippine) Gold for Crolles, TSMC & Rousset Dice, - AMKOR ATP (Philippine) Copper Palladium wire for Crolles, TSMC Dice, - ASE Kaohsiung (Taiwan) Gold wire for Crolles, TSMC & Rousset Dice, - ASE Kaohsiung (Taiwan) Copper Palladium wire for Crolles & TSMC Dice, - JSCC (China) Gold for Crolles, TSMC & Rousset Dice, - JSCC (China) Copper Palladium wire for Crolles, TSMC Dice. Additional assembly site for extended capacity: - ASE Kaohsiung (Taiwan) Copper Palladium wire for Rousset Dice.
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| 2025/07/03 |
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PCN(Product Change Notice)
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PCN No.:MICROCONTROLLERS/25/15246 Change Desc.:Generic communication - Enhanced traceability with 2D marking for STM32 and STM8 listed products(1/3)
old/ Marking composition with no 2D marking
New/ New marking composition with 2D marking for production assembly |
| 2025/07/18 |
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PCN(Product Change Notice)
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PCN No. CRP/25/15294 Change Desc. Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)
Timing / schedule Intended start of delivery 2025-08-18 |
| 2025/08/12 |
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PCN(Product Change Notice)
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Supplier Notice No.:MICROCONTROLLERS/25/15304 Title:ST ROUSSET (France) additional source for STM32F75x/74x listed products in M10/90nm technology.
Description: Old/ Front-end sources for Die 449 cut1.1 : - ST Crolles (France) CR300 revision Z - TSMC (Taiwan) FAB14 revision 1
New/ Front-end sources for Die 449 cut1.1 : - ST Crolles (France) CR300 revision Z - TSMC (Taiwan) FAB14 revision 1 Additional source - ST Rousset (France) RS8F revision 2
Anticipated Impact on form,fit,function, quality, reliability or processability? No change on Form, Fit or Function - same datasheet.
Intended start of delivery: 2025-08-12 |
| 2025/08/12 |
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PCN(Product Change Notice)
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PCN No.:EMBEDDED PROCESSING/25/15304 Change Desc.:ST ROUSSET (France) additional source for STM32F75x/74x listed products in M10/90nm technology.
Intended start of delivery: 2025-08-12 |