| 2024/04/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:HDL2-0371 Title: Supplier addition of mold resin for LQFP products in RH850 and RL78 Series.
Description of Change: Renesas will add a mold-resin supplier for LQFP products in RH850/F1, D1, P1, E1, C1, R1 and RL78/F1,D1A Series as follows: Mold Resin: Supplier Addition Before Change/Supplier A After Change/Supplier A and Supplier B
Reason for Change: For countermeasures against an issue in which there is possibility of supply shortage due to the current mold-resin supplier at the present moment, and moreover, to realize stable product supply by adding mold-resin suppliers for the future.
Impact on Fit, Form, Function, Quality & Reliability: The change will have no impact on the form, fit, function, quality and reliability of the devices.
Effective Date: 4/1/2024 |
| 2025/06/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:HPLM-2024-0019 Title: Supplier addition of Cu-wire for LQFP products in RH850/F1, R1 and D1 Series
Description of Change: Renesas will add a Cu-wire supplier for LQFP products in RH850/F1, R1 and D1 Series as follows: Item / Before Change / After Change Cu-wire: Supplier Addition / Supplier A / Supplier A and Supplier B
Reason for Change: For stable product supply by adding Cu-wire suppliers.
Impact on Fit, Form, Function, Quality & Reliability: The change will have no impact on the form, fit, function, quality and reliability of the devices.
Effective Date: 6/1/2025 |
| 2025/06/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:HPLM-2024-0040 Title: Supplier addition of Cu-wire for LQFP products in RH850/F1, R1 and D1 Series
Description of Change: Renesas will add a Cu-wire supplier for LQFP products in RH850/F1, R1 and D1 Series as follows: Item / Before Change / After Change Cu-wire: Supplier Addition / Supplier A / Supplier A and Supplier B
Applicable Assembly Factory Renesas Electronics Corporation Nishiki Factory Renesas Semiconductor (Suzhou) Co., Ltd.
Reason for Change: For stable product supply by adding Cu-wire suppliers.
Impact on Fit, Form, Function, Quality & Reliability: The change will have no impact on the form, fit, function, quality and reliability of the devices.
Effective Date: 6/1/2025 |
| 2025/12/01 |
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PCN(Product Change Notice)
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Supplier Notice No.HPLM-2025-0147 Title:(4/5)Change of Wafer Process material for RH850 Series (RV40F)
Description of Change: Renesas will change material of Wafer Process to the TSMC standard for Naka and TSMC products in RH850 Series.
Reason for Change: For stable supply of products
Impact on Fit, Form, Function, Quality & Reliability: The change will have no impact on the fit, form, function, quality and reliability of the devices.
Effective Date: 12/1/2025
*As there are a number of applicable products, we will inform you of them in separate notices. |
| 2026/02/02 |
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PCN(Product Change Notice)
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Supplier Notice No.:HPLM-2025-0140 Title:Standardization of Lead Frame and Support Tape for Suzhou and Nishiki products in RH850 Series
Description of Change: Renesas will standardize Lead Frame and Support Tape for products assembled at Suzhou and Nishiki in RH850 Series.
Reason for Change: For stable supply of products by realizing standardization of assembly materials.
Impact on Fit, Form, Function, Quality & Reliability: The change will have no impact on the fit, form, function, quality and reliability of the devices.
Effective Date: 2/2/2026 |
| 2026/03/02 |
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PCN(Product Change Notice)
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PCN No. HPLM-2025-0181 Change Desc. New production facilities for RH850/F1KM-S2, F1KM-S4 (BGA), and F1KH-D8. Wafer process (WP) and wafer test (WT): Naka Factory added.
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