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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2023/03/01 PCN(Product Change Notice) MCU/SOC products announcement of Full Carton
2023/03/01 PCN(Product Change Notice) MCU/SOC products announcement of Full Carton
2023/05/25 PCN(Product Change Notice) Renesas will change packing form with a tray to Full Carton (full packing) from fraction.
Change Implementation: 1.Mar. 2023
25.May. 2023 (items in red on page 11) updated
2023/05/29 PCN(Product Change Notice) Full cartonization of MCU/SoC products
Change of order type name due to change in packaging style
2025/03/01 PCN(Product Change Notice) Supplier Notice No.:
Title:
Notice of Change of Die-Bond Material for RA, SYNERGY and RX Surface-Mount Package Productsa

Description of Change:
The back-end factory: Renesas Semiconductor (Suzhou) Co., Ltd (“Suzhou”).
Changes: The die-bond material will be changed. The new die-bond material is a proven one for mass production at “Suzhou”.

Reason for Change:
To change to an alternate material due to the termination of supply of the material by the die-bond materials manufacturer.

Impact on Fit, Form, Function, Quality & Reliability:
This change will not affect fitting, form, function, quality, and reliability.

Effective Date:
3/1/2025
2025/03/01 PCN(Product Change Notice) NOTICE OF CHANGE OF DIE-BOND MATERIAL FOR RA, SYNERGY AND RX SURFACE-MOUNT PACKAGE PRODUCTS
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PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

Product & Sales Information of products subject to notification

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Products: 994 out of cases/Show 1 to 25






   12345  Last  NEXT
Products: 994 out of cases/Show 1 to 25