| 2022/02/13 |
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PCN(Product Change Notice)
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Qualification of HFTF as additional Assembly site for select devices |
| 2022/04/14 |
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PCN(Product Change Notice)
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Qualification of HFTF as additional Assembly site for select devices
Revision A is to update the description of change to include a change in mold compound for the proposed change. We apologize for any inconvenience this may have caused.
Proposed 1st Ship Date: Apr 14, 2022
ASESH HFTF Mold Compound EN2000763 R-30
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| 2024/04/22 |
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PCN(Product Change Notice)
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Texas Instruments Incorporated is announcing the qualification of additional Assembly sites for devices listed below in the product affected section.
Proposed 1st Ship Date: July 17, 2024 |
| 2024/06/20 |
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PCN(Product Change Notice)
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Supplier Notice No.:20240619002.0 Title: Datasheet for OPA656, TPS62901, TCA9617B
Description of Change: Texas Instruments Incorporated is announcing an information only notification. The product datasheet(s) is being updated as summarized below.
The datasheet number will be changing. Device Family: Change From: -> Change To: OPA656 : SBOS196H -> SBOS196I TPS62901 : SLVSFS7 -> SLVSFS7A TCA9617B : SCPS259B -> SCPS259C
These changes may be reviewed at the datasheet links provided. http://www.ti.com/product/OPA656 http://www.ti.com/product/TPS62901 http://www.ti.com/product/TCA9617B
Reason for Change: To accurately reflect device characteristics.
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive /negative): No anticipated impact. There are no changes to the actual device. |
| 2024/06/24 |
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PCN(Product Change Notice)
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Texas Instruments Incorporated is announcing an information only notification. |
| 2024/06/26 |
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PCN(Product Change Notice)
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Qualification of RFAB using qualified Process Technology, Die Revision & BOM~option for select devicess |