| 2022/12/20 |
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PCN(Product Change Notice)
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Product enhancement Die redesign : Mask or mask set change with new die design like metallization (specifically chip frontside) or bug fix Timing / schedule Intended start of delivery 2022-12-20 |
| 2023/05/15 |
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PCN(Product Change Notice)
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ASE KaoHsiung (Taiwan) LQFP7x7, LQFP10x10, LQFP14x14 and LQFP20x20 package copper palladium bonding wire introduction on STM32F2/F4/F7x, STM32G0/G4x, STM32L4/L5x and STM32H5/H7x listed products
Timing / schedule Intended start of delivery 2023-05-15 |
| 2024/04/15 |
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PCN(Product Change Notice)
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Description of change Old Current Wire bonding material: - JSCC (China) Gold wire or Silver wire - ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire New Current Wire bonding material: - JSCC (China) Gold wire or Silver wire - ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire Added Wire bonding material : - JSCC (China) Copper Palladium wire
Timing / schedule Intended start of delivery 2024-06-30 |
| 2024/06/30 |
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PCN(Product Change Notice)
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Supplier Notice No.:MDG/24/14363 Title: JJSCC (China) LQFP7x7 32L/48L , LQFP10x10 64L and LQFP12x12 80L package copper palladium bonding wire introduction on STM32C0x, STM32G0/G4x, STM32H5/H7x, STM32L4/L5x and STM32U5x listed products
Description of change: Old Current Wire bonding material: - JSCC (China) Gold wire or Silver wire - ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire
New Current Wire bonding material: - JSCC (China) Gold wire or Silver wire - ASE Kaohsiung (Taiwan) Gold wire or Copper Palladium wire
Added Wire bonding material : - JSCC (China) Copper Palladium wire
Anticipated Impact on form,fit,function, quality, reliability orprocessability? no impact on form, Fit, Function
Intended start of delivery: 2024-06-30 |
| 2024/07/23 |
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PCN(Product Change Notice)
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Old: Front-end sources for die 460 cut2.1 / die 467 cut 1.1 - TSMC (Taiwan) FAB14 New: Front-end sources for die 460 cut2.1 / die 467 Cut 1.1 - TSMC (Taiwan) FAB14 - Crolles 300 ( France) additional source
Timing / schedule Intended start of delivery 2024-09-13 |
| 2024/09/02 |
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PCN(Product Change Notice)
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Supplier Notice No.:24/14718 Title: ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products
Description of change: Old/Marking composition with no 2D marking New/New marking composition with 2D marking for production assembly
Motivation: to enhance traceability
Intended start of delivery: 2024-09-02 |
| 2024/12/04 |
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PCN(Product Change Notice)
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Supplier Notice No.:MICROCONTROLLERS/24/15033 Title: JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products
Description of change: Old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly
Anticipated Impact on form,fit,function, quality, reliability or processability? Form: Change is visible on marking area Fit : No change Function : No change Reliability : No change Processability : No change
Intended start of delivery: 2024-12-04
Intended start of delivery 2024-12-04 |
| 2024/12/04 |
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PCN(Product Change Notice)
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JSCC (China) Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP12x12 list of products |
| 2025/04/15 |
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PCN(Product Change Notice)
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Supplier Notice No.:MICROCONTROLLERS/25/15166 Title: JSCC (China) - KOSTAT Carrier Tape & Cover Tape alternative packing material for TQFP7x7 & QFP10x10 package on listed products.
Description of change: Old/ For QFP7X7, QFP10X10 packages - E-PAK carrier tape and cover tape
New/ For QFP7X7 & QFP10X10 packages - E-PAK carrier tape and cover tape (until depletion of current material). - Then KOSTAT carrier tape (4-side partial fence) and cover tape.
Intended start of delivery: 2025-04-15 |
| 2025/04/15 |
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PCN(Product Change Notice)
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Description of change Old : Refer to application Note AN2606 Revision 65 - February 2025 : STM32G071/81xx listed devices having the Bootloader version 11.3 - Empty check Flag is cleared by error on the boot sequence - I2C connection stretching the line for a long time which is not supported by some HW hosts
New : Refer to application Note AN2606 Revision 66 - April 2025/ STM32G071/81xx devices will have the new Bootloader version 11.4 : - A global peripherals de-init was added on the BL boot sequence to fix issues generating deinitialization of all resources needed by the BL SW so clearing the empty check flag. - I2C connection stretching the line for a long time which is not supported by some HW hosts is fixed
Timing / schedule Intended start of delivery 2025-04-15
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| 2025/07/18 |
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PCN(Product Change Notice)
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PCN No. CRP/25/15294 Change Desc. Additional 2D in ST Standard Inner Bulk Label (MDRF perimeter)
Timing / schedule Intended start of delivery 2025-08-18 |
| 2025/09/02 |
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PCN(Product Change Notice)
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ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14, LQFP20x20 & LQFP24x24 listed products |
| 2025/09/02 |
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PCN(Product Change Notice)
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Supplier Notice No.:MDG/24/14718 Title: ASE Kaohsiung Enhanced traceability with 2D marking for LQFP7x7, LQFP10x10, LQFP14x14,LQFP20x20 & LQFP24x24 listed products
Description of change: Old/ Marking composition with no 2D marking New/ New marking composition with 2D marking for production assembly
Motivation: to enhance traceability
Anticipated Impact on form,fit,function, quality, reliability or processability? Form: Change is visible on marking area Fit : No change Function : No change Reliability : No change Processability : No change
Intended start of delivery: 2025-09-02
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