| 2021/07/08 |
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PCN(Product Change Notice)
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Amkor Philippines as an Alternate Site for TSSOP_4.4 At the additional factory, some packaging materials are different from the current factory. Assembly factory: Present: Carsem Malaysia (main factory) Future: Amkor Philippines (main factory), Carsem Malaysia Package material: Die Attach: Hysol QMI519 (current) => Abrestik 8290 (additional factory) MoldCompound: Sumitomo G700HA (current) => Sumitomo G700K (additional factory) |
| 2021/11/12 |
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PCN(Product Change Notice)
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Amkor Philippines as an Alternate Site for TSSOP_4.4 Publication Date: 10-Aug-2021 Effectivity Date: 12-Nov-2021 Description Of Change: ADI will be utilizing Amkor Philippines as an alternate assembly site for TSSOP_4.4. |
| 2023/08/10 |
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PCN(Product Change Notice)
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Qualification of Alternate Wafer Fab Site at ADI Limerick for 0.6um CMOS Amplifier Product Effectivity Date: 10-Aug-2023 (the earliest date that a customer could expect to receive changed material) |
| 2024/05/06 |
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PCN(Product Change Notice)
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Supplier Notice No.:PCN 23_0068 Rev. A Title: Qualification of Alternate Wafer Fab Site at ADI Limerick for 0.6um CMOS Amplifier Product
Description Of Change: 1) Analog Devices is adding Analog Devices, Limerick (ADLK) as an alternate Wafer Fab site to TSMC Fab 9, Fab 2A and Fab2B for 0.6um CMOS Amplifier products. 2) Changed wafer diameter from 6"" to 8"" for a limited number of parts, refer to table in Supporting Documents section for substrate change details.
Reason For Change: This change will ensure manufacturing agility and continuity of supply.
Impact of the change (positive or negative) on fit, form, function & reliability: There is no impact to fit, form, function, or reliability.
Effectivity Date: 10-May-2024 (the earliest date that a customer could expect to receive changed material) |