| 2022/10/07 |
|
PCN(Product Change Notice)
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Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages Effectivity Date: 07-Oct-2022 |
| 2022/10/20 |
|
PCN(Product Change Notice)
|
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages Effectivity Date: 20-Oct-2022 |
| 2022/10/20 |
|
PCN(Product Change Notice)
|
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages |
| 2022/10/20 |
|
PCN(Product Change Notice)
|
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages |
| 2022/10/20 |
|
PCN(Product Change Notice)
|
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages Effectivity Date: 20-Oct-2022 (the earliest date that a customer could expect to receive changed material) |
| 2024/05/05 |
|
PCN(Product Change Notice)
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Supplier Notice No.:PCN 24_0009 Rev. - Title: Qualification of alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process
Description Of Change: Analog Device is adding Analog Devices Beaverton OR, USA (ADBN) as an alternate Wafer Fab site to TSMC Taiwan for 0.18um Mixed Signal CMOS Process.
Reason For Change: This change will ensure manufacturing agility and continuity of supply.
Impact of the change (positive or negative) on fit, form, function & reliability: There is no impact to form, fit, function or reliability.
Effectivity Date: 05-May-2024 (the earliest date that a customer could expect to receive changed material) |
| 2026/01/07 |
|
PCN(Product Change Notice)
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PCN No.: PCN 24_0009 Rev. H Change Desc.:Qualification of Alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process. Analog Device is qualifying Analog Devices BeavertonOR,USA(ADBN) as an alternate Wafer Fab site for 0.18umMixed Signal CMOS Process.
Reason For Change: This change will ensure manufacturing agility and continuity of suppl
Revision Description: Minor correction to the PCN description for improved accuracy. |