| 2021/03/21 |
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PCN(Product Change Notice)
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Capacity expansion with introduction of an additional assembly and final test location at Huayi Microelectronics Co., Ltd (HYME), China for dedicated TO220 3L MOSFET products in Gen 5.X/7.X/10.X |
| 2021/11/15 |
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PCN(Product Change Notice)
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Removal of legacy International Rectified (IR) logo from tube and packing box affecting products from assembly location Rectificadores Internacionales, S.A. de C.V., Tijuana , Mexico. Reason: Standardization of packing material across Infineon sites
Description Old: Outer packing box and plastic tube with legacy IR logo New: Legacy IR logo removed from packing box and plastic tube |
| 2023/12/11 |
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PCN(Product Change Notice)
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Phase out of Kyocera KEG300 mold compound for several assembly locations and change of lead finish from tin dip to electro plating at Tijuana, Mexico for dedicated TO220-3 & TO247-3 products Reason To ensure continuity of mold compound supply due to Kyocera KEG300 end of life and to further ensure our product performance with lead-free electroplating finish Description Assembly materials:Mold compound Old: Kyocera KEG300 New: Sumitomo EME-E500 Assembly materials:Lead finish (Tijuana only) Old: Tin dip finish New: Lead-free electroplating finish
Intended start of delivery 2024-02-29 |
| 2024/02/29 |
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PCN(Product Change Notice)
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Phase out of Kyocera KEG300 mold compound for several assembly locations and change of lead finish from tin dip to electro plating at Tijuana, Mexico for dedicated TO220-3 & TO247-3 products |
| 2024/07/30 |
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PCN(Product Change Notice)
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Supplier Notice No.:2024-112-A Title: Change of the wafer production location from Infineon Technologies Temecula, USA and EPISIL Technologies Inc., Taiwan to Sichuan Gen Microelectronics co.LTD, China for dedicated GEN5 and GEN7 N-Channel MOSFET products.
Reason: The wafer production of the affected products will be transferred to Sichuan Gen Microelectronics co.LTD, China, according to global Infineon production strategy
Description: Wafer Fab Location/Old ? Infineon Technologies Temecula, USA ? EPISIL Technologies Inc., Taiwan Wafer Fab Location/New ? Sichuan Gen Microelectronics co.LTD, China
Impact of change: No
Intended start of delivery: 2024-07-30 or earlier based on customer approval |